thermal/core: Add dedicated release callback for cooling devices

The thermal class release callback currently handles both thermal
zones and cooling devices by checking the device name prefix.

Move the cooling device cleanup to a dedicated struct device release
callback.  This avoids relying on device names to select the release
path and keeps the cooling device lifetime handling local to the
cooling device object.

Signed-off-by: Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Link: https://patch.msgid.link/20260508180511.1306659-2-daniel.lezcano@oss.qualcomm.com
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

0 files changed, 0 insertions, 0 deletions