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| author | Daniel Lezcano <daniel.lezcano@oss.qualcomm.com> | 2026-05-08 20:05:09 +0200 |
|---|---|---|
| committer | Rafael J. Wysocki <rafael.j.wysocki@intel.com> | 2026-05-13 21:03:15 +0200 |
| commit | dc04e81fa2188d96af0c795ff45e4e5a209183b2 (patch) | |
| tree | b271169a443063516cbfef26726f661eefacb497 /drivers/platform/wmi/tests/git@git.tavy.me:linux.git | |
| parent | 11568924a9319c951f7086c002741c03d4d0f740 (diff) | |
thermal/core: Add dedicated release callback for thermal zones
The thermal class release callback currently handles thermal zone
cleanup by checking the device name prefix.
Move the thermal zone cleanup to a dedicated struct device release
callback. This avoids relying on device names to select the release
path and keeps the thermal zone lifetime handling local to the thermal
zone object.
Signed-off-by: Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Link: https://patch.msgid.link/20260508180511.1306659-3-daniel.lezcano@oss.qualcomm.com
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Diffstat (limited to 'drivers/platform/wmi/tests/git@git.tavy.me:linux.git')
0 files changed, 0 insertions, 0 deletions
