thermal/of: Support cooling device ID in cooling-spec

Extend the cooling device specifier parsing to support an optional
cooling device identifier (cdev_id).

Two formats are now supported:

  - Legacy format:
        <&cdev lower upper>

  - Indexed format:
        <&cdev cdev_id lower upper>

When the indexed format is used, both the device node and the
cdev_id must match in order to bind a cooling device to a thermal
zone. The legacy format continues to match on the device node only,
preserving backward compatibility.

Update the parsing logic accordingly to handle both formats and
extract the mitigation limits from the appropriate arguments.

This is a preparatory step for upcoming DT bindings describing
cooling devices using (device node, id) tuples instead of child
nodes.

No functional change for existing device trees.

Signed-off-by: Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Acked-by: Rafael J. Wysocki (Intel) <rafael@kernel.org>
Link: https://patch.msgid.link/20260526140802.1059293-21-daniel.lezcano@oss.qualcomm.com

0 files changed, 0 insertions, 0 deletions