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authorDaniel Lezcano <daniel.lezcano@oss.qualcomm.com>2026-05-26 16:08:06 +0200
committerDaniel Lezcano <daniel.lezcano@kernel.org>2026-06-03 09:12:50 +0200
commit27559121b2e3ffbdfdbb77b528ba1015e2617daa (patch)
tree68de7a0b973d2493ee317f79fb26d63a07da360f /drivers/platform/wmi/tests/git@git.tavy.me:linux.git
parent61e7550fe8b26c2b132eff2ced57c6b2dd93ca7f (diff)
thermal/of: Move cooling device OF helpers out of thermal core
The functions: - thermal_of_cooling_device_register() - devm_thermal_of_cooling_device_register() are specific to device tree usage but are currently implemented in thermal_core.c. Move them to thermal_of.c to better reflect the separation between generic thermal core code and OF-specific logic. This change is enabled by the recent split of the cooling device registration into allocation and addition phases, allowing OF-specific handling (such as device node assignment) to be isolated from the core. No functional change intended. Signed-off-by: Daniel Lezcano <daniel.lezcano@oss.qualcomm.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org> Reviewed-by: Lukasz Luba <lukasz.luba@arm.com> Acked-by: Rafael J. Wysocki (Intel) <rafael@kernel.org> Link: https://patch.msgid.link/20260526140802.1059293-17-daniel.lezcano@oss.qualcomm.com
Diffstat (limited to 'drivers/platform/wmi/tests/git@git.tavy.me:linux.git')
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