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authorGaurav Kohli <gaurav.kohli@oss.qualcomm.com>2026-05-26 16:08:11 +0200
committerDaniel Lezcano <daniel.lezcano@kernel.org>2026-06-03 09:12:59 +0200
commit6d0c207c0a95bc4832fe0189973f64734ef5bfc0 (patch)
tree964a82ccadb77edec184219f24b5bf7c8d8f122b
parent2baee1cc03c65a35f0d053e5c5e646a3bdf6ed85 (diff)
dt-bindings: thermal: cooling-devices: Update support for 3 cells cooling device
Extend the thermal cooling device binding to support a 3 cells specifier along with the 2 cells format. Update #cooling-cells property to enum to support both 2 and 3 arguments. Fix pwm-fan.yaml to restrict the number of cells to 'const: 2' Signed-off-by: Gaurav Kohli <gaurav.kohli@oss.qualcomm.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@oss.qualcomm.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com> Reviewed-by: Lukasz Luba <lukasz.luba@arm.com> Acked-by: Rafael J. Wysocki (Intel) <rafael@kernel.org> Link: https://patch.msgid.link/20260526140802.1059293-22-daniel.lezcano@oss.qualcomm.com
-rw-r--r--Documentation/devicetree/bindings/hwmon/pwm-fan.yaml3
-rw-r--r--Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml8
-rw-r--r--Documentation/devicetree/bindings/thermal/thermal-zones.yaml3
3 files changed, 10 insertions, 4 deletions
diff --git a/Documentation/devicetree/bindings/hwmon/pwm-fan.yaml b/Documentation/devicetree/bindings/hwmon/pwm-fan.yaml
index a84cc3a4cfdc..6a24851fd80d 100644
--- a/Documentation/devicetree/bindings/hwmon/pwm-fan.yaml
+++ b/Documentation/devicetree/bindings/hwmon/pwm-fan.yaml
@@ -63,7 +63,8 @@ properties:
description: The PWM that is used to control the fan.
maxItems: 1
- "#cooling-cells": true
+ "#cooling-cells":
+ const: 2
required:
- compatible
diff --git a/Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml b/Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml
index b9022f1613d8..28f5818f1e60 100644
--- a/Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml
+++ b/Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml
@@ -44,10 +44,14 @@ select: true
properties:
"#cooling-cells":
description:
- Must be 2, in order to specify minimum and maximum cooling state used in
+ Must be 2 or 3. If 2, specifies minimum and maximum cooling state used in
the cooling-maps reference. The first cell is the minimum cooling state
and the second cell is the maximum cooling state requested.
- const: 2
+ If 3, the first cell specifies the thermal mitigation device specifier
+ index for devices that support multiple thermal mitigation mechanisms.
+ The two other cells are respectively the minimum cooling state and the
+ maximum cooling state.
+ enum: [2, 3]
additionalProperties: true
diff --git a/Documentation/devicetree/bindings/thermal/thermal-zones.yaml b/Documentation/devicetree/bindings/thermal/thermal-zones.yaml
index 07d9f576ffe7..999ad40a20d5 100644
--- a/Documentation/devicetree/bindings/thermal/thermal-zones.yaml
+++ b/Documentation/devicetree/bindings/thermal/thermal-zones.yaml
@@ -211,7 +211,8 @@ patternProperties:
device. Using the THERMAL_NO_LIMIT (-1UL) constant in the
cooling-device phandle limit specifier lets the framework
use the minimum and maximum cooling state for that cooling
- device automatically.
+ device automatically. If three arguments are specified,
+ the first argument is the cooling device specifier.
contribution:
$ref: /schemas/types.yaml#/definitions/uint32