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authorUmang Chheda <umang.chheda@oss.qualcomm.com>2026-03-04 22:29:25 +0530
committerBjorn Andersson <andersson@kernel.org>2026-03-26 09:40:52 -0500
commitb64abb26a2916e33cc9dcc00a48fa31fef255697 (patch)
tree228e82451ec6507d4f1176656806f2b0c4b45d44 /tools
parent5a67924d2fc5787d894bdbd8a87ad6794487060d (diff)
arm64: dts: qcom: lemans-evk: Add IFP Mezzanine
The Interface Plus [IFP] Mezzanine is an hardware expansion add-on board designed to be stacked on top of Lemans EVK. It has following peripherals : - 4x Type A USB ports in host mode. - TC9563 PCIe switch, which has following three downstream ports (DSP) : - 1st DSP is routed to an M.2 E-key connector, intended for WLAN modules. - 2nd DSP is routed to an M.2 B-key connector, intended for cellular modems. - 3rd DSP with support for Dual Ethernet ports. - eMMC. - Additional 2.5GbE Ethernet PHY connected to native EMAC with support for MAC Address configuration via NVMEM. - EEPROM. - LVDS Display. - 2*mini DP. Add support for following peripherals : - TC9563 PCIe Switch. - Additional 2.5GbE Ethernet Port. - EEPROM. Enable support for USB hub, LVDS display and mini-DP later once dependent changes are available in lemans-evk core-kit. Written with inputs from : Mohd Ayaan Anwar <mohd.anwar@oss.qualcomm.com> - Ethernet. Krishna Chaitanya Chundru <krishna.chundru@oss.qualcomm.com> - PCIe Monish Chunara <monish.chunara@oss.qualcomm.com> - EEPROM. Signed-off-by: Umang Chheda <umang.chheda@oss.qualcomm.com> Reviewed-by: Konrad Dybcio <konrad.dybcio@oss.qualcomm.com> Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@oss.qualcomm.com> Link: https://lore.kernel.org/r/20260304165925.1535938-2-umang.chheda@oss.qualcomm.com Signed-off-by: Bjorn Andersson <andersson@kernel.org>
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