linux.git/include/linux/thermal.h, branch v7.2-rc1

thermal/core: Fix missing stub for devm_thermal_cooling_device_register

2026-06-03T07:13:00+00:00

Even it is very unlikely the thermal framework is disabled, the newly
added devm_thermal_cooling_device_register() function has not the stub
when the thermal framework is optout in the kernel.

Add it.

Reported-by: kernel test robot 
Closes: https://lore.kernel.org/oe-kbuild-all/202605301554.S9n45bfQ-lkp@intel.com/
Signed-off-by: Daniel Lezcano 
Acked-by: Rafael J. Wysocki (Intel) 
Link: https://patch.msgid.link/20260601090152.1243983-2-daniel.lezcano@kernel.org

thermal/of: Pass cdev_id and introduce devm registration helper

2026-06-03T07:12:56+00:00

Extend the OF cooling device registration to support an explicit
cooling device identifier (cdev_id), preparing for upcoming DT
bindings where cooling devices are identified by a tuple (device node,
id) instead of relying on child nodes.

Introduce a new helper:

  devm_thermal_of_cooling_device_register()

which registers a cooling device using the device's of_node and an
explicit cdev_id. This complements the existing
devm_thermal_of_child_cooling_device_register() helper, which
remains dedicated to the legacy child-node based bindings.

Internally, factorize the devm registration logic into a common
helper to avoid code duplication.

Existing users are unaffected, as the child-based helper continues
to pass a default cdev_id of 0, preserving current behavior.

This change is a preparatory step for supporting indexed cooling
devices in thermal OF bindings.

Signed-off-by: Daniel Lezcano 
Signed-off-by: Daniel Lezcano 
Reviewed-by: Lukasz Luba 
Acked-by: Rafael J. Wysocki (Intel) 
Link: https://patch.msgid.link/20260526140802.1059293-20-daniel.lezcano@oss.qualcomm.com

thermal/of: Add cooling device ID support

2026-06-03T07:12:55+00:00

Introduce an identifier (cdev_id) for cooling devices registered from
device tree.

This prepares support for a new DT binding where cooling devices are
identified by a tuple (device node, ID), instead of relying on child
nodes.

Existing users are updated to pass a default ID of 0, preserving the
current behavior.

Future changes will extend the cooling map parsing to match cooling
devices based on both the device node and the ID.

No functional change intended.

Signed-off-by: Daniel Lezcano 
Signed-off-by: Daniel Lezcano 
Reviewed-by: Lukasz Luba 
Acked-by: Rafael J. Wysocki (Intel) 
Link: https://patch.msgid.link/20260526140802.1059293-19-daniel.lezcano@oss.qualcomm.com

thermal/of: Rename the devm_thermal_of_cooling_device_register() function

2026-06-03T07:12:53+00:00

To clarify that the function operates on child nodes, rename:

          devm_thermal_of_cooling_device_register()
	                     |
			     v
       devm_thermal_of_child_cooling_device_register()

Used the command:

     	 find . -type f -name '*.[ch]' -exec \
	 sed -i 's/devm_thermal_of_cooling_device_register/\
	 devm_thermal_of_child_cooling_device_register/g' {} \;

Did not used clang-format-diff because it does not indent correctly
and checkpatch complained. Manually reindented to make checkpatch
happy

This prepares for upcoming support of cooling devices identified by
an ID rather than device tree child nodes.

No functional change.

Signed-off-by: Daniel Lezcano 
Signed-off-by: Daniel Lezcano 
Reviewed-by: Lukasz Luba 
Acked-by: Rafael J. Wysocki (Intel) 
Link: https://patch.msgid.link/20260526140802.1059293-18-daniel.lezcano@oss.qualcomm.com

thermal/core: Make cooling device OF node conditional on CONFIG_THERMAL_OF

2026-06-03T07:12:51+00:00

The device node pointer stored in struct thermal_cooling_device is
only used by the OF-specific thermal code to associate cooling devices
with thermal zones defined in device tree.

Now that OF and non-OF registration paths are separated and non-OF
users no longer rely on devm_thermal_of_cooling_device_register() with
a NULL device node, the np field is no longer required for non-OF
configurations.

Make this field conditional on CONFIG_THERMAL_OF to reduce memory
footprint and better reflect its usage.

Signed-off-by: Daniel Lezcano 
Signed-off-by: Daniel Lezcano 
Acked-by: Rafael J. Wysocki (Intel) 
Reviewed-by: Lukasz Luba 
Link: https://patch.msgid.link/20260526140802.1059293-16-daniel.lezcano@oss.qualcomm.com

thermal/of: Move cooling device OF helpers out of thermal core

2026-06-03T07:12:50+00:00

The functions:
 - thermal_of_cooling_device_register()
 - devm_thermal_of_cooling_device_register()

are specific to device tree usage but are currently implemented in
thermal_core.c.

Move them to thermal_of.c to better reflect the separation between
generic thermal core code and OF-specific logic.

This change is enabled by the recent split of the cooling device
registration into allocation and addition phases, allowing OF-specific
handling (such as device node assignment) to be isolated from the core.

No functional change intended.

Signed-off-by: Daniel Lezcano 
Signed-off-by: Daniel Lezcano 
Reviewed-by: Lukasz Luba 
Acked-by: Rafael J. Wysocki (Intel) 
Link: https://patch.msgid.link/20260526140802.1059293-17-daniel.lezcano@oss.qualcomm.com

thermal/core: Add devm_thermal_cooling_device_register()

2026-06-03T07:12:40+00:00

Introduce a device-managed variant of the non-OF cooling device
registration API.

This complements devm_thermal_of_cooling_device_register() and allows
non-device-tree users to register cooling devices with automatic
cleanup tied to the device lifecycle.

The helper relies on devm_add_action_or_reset() to release the cooling
device via thermal_cooling_device_release() on driver detach or probe
failure.

This keeps the API consistent across OF and non-OF users and avoids
manual cleanup in error paths.

Signed-off-by: Daniel Lezcano 
Signed-off-by: Daniel Lezcano 
Reviewed-by: Lukasz Luba 
Acked-by: Rafael J. Wysocki (Intel) 
Link: https://patch.msgid.link/20260526140802.1059293-14-daniel.lezcano@oss.qualcomm.com

thermal: core: Suspend thermal zones later and resume them earlier

2026-04-08T10:30:31+00:00

To avoid some undesirable interactions between thermal zone suspend
and resume with user space that is running when those operations are
carried out, move them closer to the suspend and resume of devices,
respectively, by updating dpm_prepare() to carry out thermal zone
suspend and dpm_complete() to start thermal zone resume (that will
continue asynchronously).

This also makes the code easier to follow by removing one, arguably
redundant, level of indirection represented by the thermal PM notifier.

Signed-off-by: Rafael J. Wysocki 
Reviewed-by: Armin Wolf 
Link: https://patch.msgid.link/2036875.PYKUYFuaPT@rafael.j.wysocki

thermal: core: Remove duplicate struct declaration

2025-03-25T19:52:04+00:00

The struct thermal_zone_device is already declared on line 32, so the
duplicate declaration has been removed.

Fixes: b1ae92dcfa8e ("thermal: core: Make struct thermal_zone_device definition internal")
Signed-off-by: xueqin Luo 
Link: https://lore.kernel.org/r/20250206081436.51785-1-luoxueqin@kylinos.cn
Signed-off-by: Daniel Lezcano

thermal: core: Add stub for thermal_zone_device_update()

2024-12-14T16:00:44+00:00

To simplify the !CONFIG_THERMAL case in the hwmon core,
add a !CONFIG_THERMAL stub for thermal_zone_device_update().

Signed-off-by: Thomas Weißschuh 
Reviewed-by: Guenter Roeck 
Acked-by: Rafael J. Wysocki 
Signed-off-by: Guenter Roeck