linux.git/include/linux/platform_data/dwc3-exynos.h, branch master Linux kernel source tree usb: dwc3: exynos: remove non-DT support for Exynos Specific Glue layer 2014-11-05T19:22:19+00:00 Jingoo Han jg1.han@samsung.com 2014-11-04T02:01:47+00:00 b4c9f578cb9608f7de0c89aa637a6af4a48061ef DWC3 Exynos Specific Glue layer can be used only for Exynos SoCs. In addition, non-DT for EXYNOS SoCs is not supported from v3.11; thus, there is no need to support non-DT for DWC3 Exynos Specific Glue layer. The 'linux/platform_data/dwc3-exynos.h' file has been used for non-DT support. Thus, the 'dwc3-exynos.h' file is removed, because it is not used anymore. Signed-off-by: Jingoo Han <jg1.han@samsung.com> Signed-off-by: Felipe Balbi <balbi@ti.com> 
DWC3 Exynos Specific Glue layer can be used only for Exynos SoCs.
In addition, non-DT for EXYNOS SoCs is not supported from v3.11;
thus, there is no need to support non-DT for DWC3 Exynos Specific
Glue layer.

The 'linux/platform_data/dwc3-exynos.h' file has been used for
non-DT support. Thus, the 'dwc3-exynos.h' file is removed, because
it is not used anymore.

Signed-off-by: Jingoo Han <jg1.han@samsung.com>
Signed-off-by: Felipe Balbi <balbi@ti.com>
usb: dwc3: Add Exynos Specific Glue layer 2012-03-02T10:11:28+00:00 Anton Tikhomirov av.tikhomirov@samsung.com 2012-02-15T08:04:56+00:00 d28a9689c93195d39f91f35a9519876688605b65 Adds Exynos Specific Glue layer to support USB peripherals on Samsung Exynos5 chips. [ balbi@ti.com : prevent compilation of Exynos glue layer on platforms which don't provide clk API implementation ] Signed-off-by: Anton Tikhomirov <av.tikhomirov@samsung.com> Signed-off-by: Felipe Balbi <balbi@ti.com> 
Adds Exynos Specific Glue layer to support USB peripherals
on Samsung Exynos5 chips.

[ balbi@ti.com : prevent compilation of Exynos glue layer
	on platforms which don't provide clk API implementation ]

Signed-off-by: Anton Tikhomirov <av.tikhomirov@samsung.com>
Signed-off-by: Felipe Balbi <balbi@ti.com>