Pull module updates from Rusty Russell:
 "Main excitement here is Peter Zijlstra's lockless rbtree optimization
  to speed module address lookup.  He found some abusers of the module
  lock doing that too.

  A little bit of parameter work here too; including Dan Streetman's
  breaking up the big param mutex so writing a parameter can load
  another module (yeah, really).  Unfortunately that broke the usual
  suspects, !CONFIG_MODULES and !CONFIG_SYSFS, so those fixes were
  appended too"

* tag 'modules-next-for-linus' of git://git.kernel.org/pub/scm/linux/kernel/git/rusty/linux: (26 commits)
  modules: only use mod->param_lock if CONFIG_MODULES
  param: fix module param locks when !CONFIG_SYSFS.
  rcu: merge fix for Convert ACCESS_ONCE() to READ_ONCE() and WRITE_ONCE()
  module: add per-module param_lock
  module: make perm const
  params: suppress unused variable error, warn once just in case code changes.
  modules: clarify CONFIG_MODULE_COMPRESS help, suggest 'N'.
  kernel/module.c: avoid ifdefs for sig_enforce declaration
  kernel/workqueue.c: remove ifdefs over wq_power_efficient
  kernel/params.c: export param_ops_bool_enable_only
  kernel/params.c: generalize bool_enable_only
  kernel/module.c: use generic module param operaters for sig_enforce
  kernel/params: constify struct kernel_param_ops uses
  sysfs: tightened sysfs permission checks
  module: Rework module_addr_{min,max}
  module: Use __module_address() for module_address_lookup()
  module: Make the mod_tree stuff conditional on PERF_EVENTS || TRACING
  module: Optimize __module_address() using a latched RB-tree
  rbtree: Implement generic latch_tree
  seqlock: Introduce raw_read_seqcount_latch()
  ...

Pull thermal management updates from Zhang Rui:
 "Specifics:

   - enhance Thermal Framework with several new capabilities:

       * use power estimates
       * compute weights with relative integers instead of percentages
       * allow governors to have private data in thermal zones
       * export thermal zone parameters through sysfs

     Thanks to the ARM thermal team (Javi, Punit, KP).

   - introduce a new thermal governor: power allocator.  First in kernel
     closed loop PI(D) controller for thermal control.  Thanks to ARM
     thermal team.

   - enhance OF thermal to allow thermal zones to have sustainable power
     HW specification.  Thanks to Punit.

   - introduce thermal driver for Intel Quark SoC x1000platform.  Thanks
     to Ong, Boon Leong.

   - introduce QPNP PMIC temperature alarm driver.  Thanks to Ivan T. I.

   - introduce thermal driver for Hisilicon hi6220.  Thanks to
     kongxinwei.

   - enhance Exynos thermal driver to handle Exynos5433 TMU.  Thanks to
     Chanwoo C.

   - TI thermal driver now has a better implementation for EOCZ bit.
     From Pavel M.

   - add id for Skylake processors in int340x processor thermal driver.

   - a couple of small fixes and cleanups."

* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (36 commits)
  thermal: hisilicon: add new hisilicon thermal sensor driver
  dt-bindings: Document the hi6220 thermal sensor bindings
  thermal: of-thermal: add support for reading coefficients property
  thermal: support slope and offset coefficients
  thermal: power_allocator: round the division when divvying up power
  thermal: exynos: Add the support for Exynos5433 TMU
  thermal: cpu_cooling: Fix power calculation when CPUs are offline
  thermal: cpu_cooling: Remove cpu_dev update on policy CPU update
  thermal: export thermal_zone_parameters to sysfs
  thermal: cpu_cooling: Check memory allocation of power_table
  ti-soc-thermal: request temperature periodically if hw can't do that itself
  ti-soc-thermal: implement eocz bit to make driver useful on omap3
  cleanup ti-soc-thermal
  thermal: remove stale THERMAL_POWER_ACTOR select
  thermal: Default OF created trip points to writable
  thermal: core: Add Kconfig option to enable writable trips
  thermal: x86_pkg_temp: drop const for thermal_zone_parameters
  of: thermal: Introduce sustainable power for a thermal zone
  thermal: add trace events to the power allocator governor
  thermal: introduce the Power Allocator governor
  ...

This patch adds the support for hisilicon thermal sensor, within
hisilicon SoC. there will register sensors for thermal framework
and use device tree to bind cooling device.

Signed-off-by: Leo Yan <leo.yan@linaro.org>
Signed-off-by: kongxinwei <kong.kongxinwei@hisilicon.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

Most code already uses consts for the struct kernel_param_ops,
sweep the kernel for the last offending stragglers. Other than
include/linux/moduleparam.h and kernel/params.c all other changes
were generated with the following Coccinelle SmPL patch. Merge
conflicts between trees can be handled with Coccinelle.

In the future git could get Coccinelle merge support to deal with
patch --> fail --> grammar --> Coccinelle --> new patch conflicts
automatically for us on patches where the grammar is available and
the patch is of high confidence. Consider this a feature request.

Test compiled on x86_64 against:

	* allnoconfig
	* allmodconfig
	* allyesconfig

@ const_found @
identifier ops;
@@

const struct kernel_param_ops ops = {
};

@ const_not_found depends on !const_found @
identifier ops;
@@

-struct kernel_param_ops ops = {
+const struct kernel_param_ops ops = {
};

Generated-by: Coccinelle SmPL
Cc: Rusty Russell <rusty@rustcorp.com.au>
Cc: Junio C Hamano <gitster@pobox.com>
Cc: Andrew Morton <akpm@linux-foundation.org>
Cc: Kees Cook <keescook@chromium.org>
Cc: Tejun Heo <tj@kernel.org>
Cc: Ingo Molnar <mingo@kernel.org>
Cc: cocci@systeme.lip6.fr
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Luis R. Rodriguez <mcgrof@suse.com>
Signed-off-by: Rusty Russell <rusty@rustcorp.com.au>

In order to avoid having each driver adding their own
specific DT property to specify slope and offset,
this patch adds a basic coefficient reading from
DT thermal zone node. Right now, as the thermal
framework does not support multiple sensors,
the current coefficients apply only to the only
sensor in the thermal zone.

The supported equation is a simple linear model:
	slope * <sensor reading> + offset.

slope and offset are read from the coefficients
DT property. In the same way as it is described in
the DT thermal binding.

So, as of today, the thermal framework will support
only cases like:
                /* hotspot = 1 * adc + 6000 */
		coefficients =          <1      6000>;

Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

It is common to have a linear extrapolation from
the current sensor readings and the actual temperature
value. This is specially the case when the sensor
is in use to extrapolate hotspots.

This patch adds slope and offset constants for
single sensor linear extrapolation equation. Because
the same sensor can be use in different locations,
from board to board, these constants are added
as part of thermal_zone_params.

The constants are available through sysfs.

It is up to the device driver to determine
the usage of these values.

Signed-off-by: Eduardo Valentin <edubezval@gmail.com>

In situations where there is an uneven number of cooling devices, the
division of power among them can lead to a milliwatt being dropped on
the floor due to rounding errors.  This doesn't sound like a lot, but
some devices only grant the lowest cooling device state for their
maximum power.  So for instance, if the granted_power is the maximum
power and all devices are getting their maximum power, one would get
max_power - 1, making it choose cooling device state 1, instead of 0.

Round the division to make the calculation more accurate.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>