Pull more thermal control updates from Rafael Wysocki:
 "These add support for debugfs-based diagnostics to the thermal core,
  simplify the thermal netlink API, fix system-wide PM support in the
  Intel HFI driver and clean up some code.

  Specifics:

   - Add debugfs-based diagnostics support to the thermal core (Daniel
     Lezcano, Dan Carpenter)

   - Fix a power allocator thermal governor issue preventing it from
     resetting cooling devices sometimes (Di Shen)

   - Simplify the thermal netlink API and clean up related code (Rafael
     J. Wysocki)

   - Make the Intel HFI driver support hibernation and deep suspend
     properly (Ricardo Neri)"

* tag 'thermal-6.8-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm:
  thermal/debugfs: Unlock on error path in thermal_debug_tz_trip_up()
  thermal: intel: hfi: Add syscore callbacks for system-wide PM
  thermal: gov_power_allocator: avoid inability to reset a cdev
  thermal: helpers: Rearrange thermal_cdev_set_cur_state()
  thermal: netlink: Rework notify API for cooling devices
  thermal: core: Use kstrdup_const() during cooling device registration
  thermal/debugfs: Add thermal debugfs information for mitigation episodes
  thermal/debugfs: Add thermal cooling device debugfs information
  thermal: netlink: Pass thermal zone pointer to notify routines
  thermal: netlink: Drop thermal_notify_tz_trip_add/delete()
  thermal: netlink: Pass pointers to thermal_notify_tz_trip_up/down()
  thermal: netlink: Pass pointers to thermal_notify_tz_trip_change()

The thermal framework does not have any debug information except a
sysfs stat which is a bit controversial. This one allocates big chunks
of memory for every cooling devices with a high number of states and
could represent on some systems in production several megabytes of
memory for just a portion of it. As the sysfs is limited to a page
size, the output is not exploitable with large data array and gets
truncated.

The patch provides the same information than sysfs except the
transitions are dynamically allocated, thus they won't show more
events than the ones which actually occurred. There is no longer a
size limitation and it opens the field for more debugging information
where the debugfs is designed for, not sysfs.

The thermal debugfs directory structure tries to stay consistent with
the sysfs one but in a very simplified way:

thermal/
 -- cooling_devices
    |-- 0
    |   |-- clear
    |   |-- time_in_state_ms
    |   |-- total_trans
    |   `-- trans_table
    |-- 1
    |   |-- clear
    |   |-- time_in_state_ms
    |   |-- total_trans
    |   `-- trans_table
    |-- 2
    |   |-- clear
    |   |-- time_in_state_ms
    |   |-- total_trans
    |   `-- trans_table
    |-- 3
    |   |-- clear
    |   |-- time_in_state_ms
    |   |-- total_trans
    |   `-- trans_table
    `-- 4
        |-- clear
        |-- time_in_state_ms
        |-- total_trans
        `-- trans_table

The content of the files in the cooling devices directory is the same
as the sysfs one except for the trans_table which has the following
format:

Transition	Hits
1->0      	246
0->1      	246
2->1      	632
1->2      	632
3->2      	98
2->3      	98

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
[ rjw: White space fixups, rebase ]
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

The ACPI thermal library contains functions that can be used to
retrieve trip point temperature values through the platform firmware
for various types of trip points.  Each of these functions basically
evaluates a specific ACPI object, checks if the value produced by it
is reasonable and returns it (or THERMAL_TEMP_INVALID if anything
fails).

It made sense to hold it in drivers/thermal/ so long as it was only used
by the code in that directory, but since it is also going to be used by
the ACPI thermal driver located in drivers/acpi/, move it to the latter
in order to keep the code related to evaluating ACPI objects defined in
the specification proper together.

No intentional functional impact.

Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

This patch adds the support for Loongson-2 thermal sensor controller,
which can support maximum four sensor selectors that corresponding to four
sets of thermal control registers and one set of sampling register. The
sensor selector can selector a speific thermal sensor as temperature input.
The sampling register is used to obtain the temperature in real time, the
control register GATE field is used to set the threshold of high or low
temperature, when the input temperature is higher than the high temperature
threshold or lower than the low temperature threshold, an interrupt will
occur.

Signed-off-by: zhanghongchen <zhanghongchen@loongson.cn>
Signed-off-by: Yinbo Zhu <zhuyinbo@loongson.cn>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230817021007.10350-1-zhuyinbo@loongson.cn

For many setups the bang-bang governor is exactly what we want. Many
ARM SoC-based devices use fans to cool down the entire SoC and that
works well only with the bang-bang governor because it uses the
hysteresis in order to let the fan run for a while to cool the SoC
down below the trip point before switching it off again.

The step-wise governor will behave strangely in these situations. It
doesn't use the hysteresis, so it can lead to situations where the fan
is turned on for only a very brief period and then is switched back off,
only to get switched back on again very quickly because the SoC hasn't
cooled down very much.

Signed-off-by: Thierry Reding <treding@nvidia.com>
Link: https://lore.kernel.org/r/20230609124408.3788680-1-thierry.reding@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>

Add MediaTek proprietary folder to upstream more thermal zone and cooler
drivers, relocate the original thermal controller driver to it, and rename it
as "auxadc_thermal.c" to show its purpose more clearly.

Signed-off-by: Balsam CHIHI <bchihi@baylibre.com>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Link: https://lore.kernel.org/r/20230209105628.50294-2-bchihi@baylibre.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

Add library routines to populate a generic thermal trip point
structure with data obtained by evaluating a specific object in the
ACPI Namespace.

Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Co-developed-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>

Since commit 0166dc11be91 ("of: make CONFIG_OF user selectable"), it
is possible to test-build any driver which depends on OF on any
architecture by explicitly selecting OF. Therefore depending on
COMPILE_TEST as an alternative is no longer needed.

It is actually better to always build such drivers with OF enabled,
so that the test builds are closer to how each driver will actually be
built on its intended target. Building them without OF may not test
much as the compiler will optimize out potentially large parts of the
code. In the worst case, this could even pop false positive warnings.
Dropping COMPILE_TEST here improves the quality of our testing and
avoids wasting time on non-existent issues.

Signed-off-by: Jean Delvare <jdelvare@suse.de>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

The userspace governor is still in use on production systems and the
deprecating warning is scary.

Even if we want to get rid of the userspace governor, it is too soon
yet as the alternatives are not yet adopted.

Change the deprecated warning by an information message suggesting to
switch to the netlink thermal events.

Fixes: 0275c9fb0eff ("thermal/core: Make the userspace governor deprecated")
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

The RZ/G2L SoC incorporates a thermal sensor unit (TSU) that measures the
temperature inside the LSI.

The thermal sensor in this unit measures temperatures in the range from
−40 degree Celsius to 125 degree Celsius with an accuracy of ±3°C. The
TSU repeats measurement at 20 microseconds intervals and automatically
updates the results of measurement.

The TSU has no interrupts as well as no external pins.

This patch adds Thermal Sensor Unit(TSU) driver for RZ/G2L SoC.

Signed-off-by: Biju Das <biju.das.jz@bp.renesas.com>
Reviewed-by: Lad Prabhakar <prabhakar.mahadev-lad.rj@bp.renesas.com>
Link: https://lore.kernel.org/r/20211130155757.17837-3-biju.das.jz@bp.renesas.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>