linux.git/drivers/thermal/Kconfig, branch v5.6

thermal/drivers/sun8i: Add thermal driver for H6/H5/H3/A64/A83T/R40

2020-01-27T09:24:32+00:00

This patch adds the support for allwinner thermal sensor, within
allwinner SoC. It will register sensors for thermal framework
and use device tree to bind cooling device.

Signed-off-by: Yangtao Li 
Signed-off-by: Ondrej Jirman 
Signed-off-by: Vasily Khoruzhick 
Acked-by: Maxime Ripard 
Signed-off-by: Daniel Lezcano 
Link: https://lore.kernel.org/r/20191219172823.1652600-2-anarsoul@gmail.com

thermal/drivers/cpu_cooling: Introduce the cpu idle cooling driver

2020-01-27T09:24:32+00:00

The cpu idle cooling device offers a new method to cool down a CPU by
injecting idle cycles at runtime.

It has some similarities with the intel power clamp driver but it is
actually designed to be more generic and relying on the idle injection
powercap framework.

The idle injection duration is fixed while the running duration is
variable. That allows to have control on the device reactivity for the
user experience.

An idle state powering down the CPU or the cluster will allow to drop
the static leakage, thus restoring the heat capacity of the SoC. It
can be set with a trip point between the hot and the critical points,
giving the opportunity to prevent a hard reset of the system when the
cpufreq cooling fails to cool down the CPU.

With more sophisticated boards having a per core sensor, the idle
cooling device allows to cool down a single core without throttling
the compute capacity of several cpus belonging to the same clock line,
so it could be used in collaboration with the cpufreq cooling device.

Signed-off-by: Daniel Lezcano 
Acked-by: Viresh Kumar 
Link: https://lore.kernel.org/r/20191219225317.17158-2-daniel.lezcano@linaro.org

thermal/drivers/Kconfig: Convert the CPU cooling device to a choice

2020-01-27T09:24:32+00:00

The next changes will add a new way to cool down a CPU by injecting
idle cycles. With the current configuration, a CPU cooling device is
the cpufreq cooling device. As we want to add a new CPU cooling
device, let's convert the CPU cooling to a choice giving a list of CPU
cooling devices. At this point, there is obviously only one CPU
cooling device.

There is no functional changes.

Signed-off-by: Daniel Lezcano 
Acked-by: Viresh Kumar 
Link: https://lore.kernel.org/r/20191204153930.9128-1-daniel.lezcano@linaro.org

thermal: power_allocator: Fix Kconfig warning

2019-12-07T13:49:06+00:00

When do randbuiding, we got this:

WARNING: unmet direct dependencies detected for THERMAL_GOV_POWER_ALLOCATOR
  Depends on [n]: THERMAL [=y] && ENERGY_MODEL [=n]
  Selected by [y]:
  - THERMAL_DEFAULT_GOV_POWER_ALLOCATOR [=y] && 

The Kconfig option THERMAL_DEFAULT_GOV_POWER_ALLOCATOR selects the
THERMAL_GOV_POWER_ALLOCATOR but this one depends on the ENERGY_MODEL
which is not enabled.

Make THERMAL_DEFAULT_GOV_POWER_ALLOCATOR depend on THERMAL_GOV_POWER_ALLOCATOR
to fix this warning.

Suggested-by: Quentin Perret 
Fixes: a4e893e802e6 ("thermal: cpu_cooling: Migrate to using the EM framework")
Signed-off-by: YueHaibing 
Signed-off-by: Daniel Lezcano 
Signed-off-by: Zhang Rui 
Link: https://lore.kernel.org/r/20191113105313.41616-1-yuehaibing@huawei.com

thermal: cpu_cooling: Migrate to using the EM framework

2019-11-07T06:02:40+00:00

The newly introduced Energy Model framework manages power cost tables in
a generic way. Moreover, it supports several types of models since the
tables can come from DT or firmware (through SCMI) for example. On the
other hand, the cpu_cooling subsystem manages its own power cost tables
using only DT data.

In order to avoid the duplication of data in the kernel, and in order to
enable IPA with EMs coming from more than just DT, remove the private
tables from cpu_cooling.c and migrate it to using the centralized EM
framework. Doing so should have no visible functional impact for
existing users of IPA since:

 - recent extenstions to the the PM_OPP infrastructure enable the
   registration of EMs in PM_EM using the DT property used by IPA;

 - the existing upstream cpufreq drivers marked with the
   'CPUFREQ_IS_COOLING_DEV' flag all use the aforementioned PM_OPP
   infrastructure, which means they all support PM_EM. The only two
   exceptions are qoriq-cpufreq which doesn't in fact use an EM and
   scmi-cpufreq which doesn't use DT for power costs.

For existing users of cpu_cooling, PM_EM tables will contain the exact
same power values that IPA used to compute on its own until now. The
only new dependency for them is to compile in CONFIG_ENERGY_MODEL.

The case where the thermal subsystem is used without an Energy Model
(cpufreq_cooling_ops) is handled by looking directly at CPUFreq's
frequency table which is already a dependency for cpu_cooling.c anyway.
Since the thermal framework expects the cooling states in a particular
order, bail out whenever the CPUFreq table is unsorted, since that is
fairly uncommon in general, and there are currently no users of
cpu_cooling for this use-case.

Acked-by: Daniel Lezcano 
Acked-by: Viresh Kumar 
Signed-off-by: Quentin Perret 
Signed-off-by: Daniel Lezcano 
Link: https://lore.kernel.org/r/20191030151451.7961-5-qperret@google.com

thermal: amlogic: Add thermal driver to support G12 SoCs

2019-11-07T06:00:26+00:00

Amlogic G12A and G12B SoCs integrate two thermal sensors
with the same design. One is located close to the DDR controller
and the other one is located close to the PLLs (between the CPU and GPU).

The calibration data for each of the thermal sensors instance is stored
in a different location within the AO region.

Implement reading the temperature from each thermal sensor.

The IP block has more functionality, which may be added to this driver
in the future:
- chip reset when the temperature exceeds a configurable threshold
- up to four interrupts when the temperature has risen above a
configurable threshold
- up to four interrupts when the temperature has fallen below a
configurable threshold

Tested-by: Christian Hewitt 
Tested-by: Kevin Hilman 
Reviewed-by: Amit Kucheria 
Signed-off-by: Guillaume La Roque 
Signed-off-by: Daniel Lezcano 
Link: https://lore.kernel.org/r/20191004090114.30694-3-glaroque@baylibre.com

thermal: db8500: Finalize device tree conversion

2019-09-25T05:54:49+00:00

At some point there was an attempt to convert the DB8500
thermal sensor to device tree: a probe path was added
and the device tree was augmented for the Snowball board.
The switchover was never completed: instead the thermal
devices came from from the PRCMU MFD device and the probe
on the Snowball was confused as another set of configuration
appeared from the device tree.

Move over to a device-tree only approach, as we fixed up
the device trees.

Cc: Vincent Guittot 
Acked-by: Lee Jones 
Reviewed-by: Daniel Lezcano 
Signed-off-by: Linus Walleij 
Signed-off-by: Eduardo Valentin

treewide: Add SPDX license identifier - Makefile/Kconfig

2019-05-21T08:50:46+00:00

Add SPDX license identifiers to all Make/Kconfig files which:

 - Have no license information of any form

These files fall under the project license, GPL v2 only. The resulting SPDX
license identifier is:

  GPL-2.0-only

Signed-off-by: Thomas Gleixner 
Signed-off-by: Greg Kroah-Hartman

Merge branch 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux

2019-05-16T23:16:18+00:00

Pull thermal management updates from Zhang Rui:

 - Remove the 'module' Kconfig option for thermal subsystem framework
   because the thermal framework are required to be ready as early as
   possible to avoid overheat at boot time (Daniel Lezcano)

 - Fix a bug that thermal framework pokes disabled thermal zones upon
   resume (Wei Wang)

  - A couple of cleanups and trivial fixes on int340x thermal drivers
    (Srinivas Pandruvada, Zhang Rui, Sumeet Pawnikar)

* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux:
  drivers: thermal: processor_thermal: Downgrade error message
  mlxsw: Remove obsolete dependency on THERMAL=m
  hwmon/drivers/core: Simplify complex dependency
  thermal/drivers/core: Fix typo in the option name
  thermal/drivers/core: Remove depends on THERMAL in Kconfig
  thermal/drivers/core: Remove module unload code
  thermal/drivers/core: Remove the module Kconfig's option
  thermal: core: skip update disabled thermal zones after suspend
  thermal: make device_register's type argument const
  thermal: intel: int340x: processor_thermal_device: simplify to get driver data
  thermal/int3403_thermal: favor _TMP instead of PTYP

thermal: Fix build error of missing devm_ioremap_resource on UM

2019-05-14T14:00:36+00:00

The devres.o gets linked if HAS_IOMEM is present so on ARCH=um
allyesconfig (COMPILE_TEST) failed on many files with:

drivers/thermal/thermal_mmio.o:
In function 'thermal_mmio_probe':thermal_mmio.c:(.text+0xe1):
undefined reference to `devm_ioremap_resource'

The users of devm_ioremap_resource() which are compile-testable
should depend on HAS_IOMEM.

Reported-by: kbuild test robot 
Signed-off-by: Talel Shenhar 
Signed-off-by: Eduardo Valentin