linux.git/Documentation/thermal, branch v3.13

thermal: thermal_core: allow binding with limits on bind_params

2013-09-03T13:10:24+00:00

When registering a thermal zone device using platform information
via bind_params, the thermal framework will always perform the
cdev binding using the lowest and highest limits (THERMAL_NO_LIMIT).

This patch changes the data structures so that it is possible
to inform what are the desired limits for each trip point
inside a bind_param. The way the binding is performed is also
changed so that it uses the new data structure.

Cc: Zhang Rui 
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin

drivers: thermal: make usage of CONFIG_THERMAL_HWMON optional

2013-09-03T13:10:11+00:00

When registering a new thermal_device, the thermal framework
will always add a hwmon sysfs interface.

This patch adds a flag to make this behavior optional. Now
when registering a new thermal device, the caller can
optionally inform if hwmon interface is desirable. This can
be done by means of passing a thermal_zone_params.no_hwmon == true.

In order to keep same behavior as of today, all current
calls will by default create the hwmon interface.

Cc: David Woodhouse 
Cc: linux-acpi@vger.kernel.org
Cc: linux-arm-kernel@lists.infradead.org
Cc: linux-kernel@vger.kernel.org
Cc: linux-pm@vger.kernel.org
Cc: Zhang Rui 
Suggested-by: Wei Ni 
Signed-off-by: Eduardo Valentin

Documentation: thermal: Explain the exynos thermal driver model

2013-08-13T13:52:04+00:00

This patch updates the documentation to explain the driver model
and file layout.

Acked-by: Jonghwa Lee 
Acked-by: Kukjin Kim 
Acked-by: Eduardo Valentin 
Signed-off-by: Amit Daniel Kachhap 
Signed-off-by: Eduardo Valentin

Merge branch 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux

2013-07-11T19:26:08+00:00

Pull thermal management updates from Zhang Rui:
 "There are not too many changes this time, except two new platform
  thermal drivers, ti-soc-thermal driver and x86_pkg_temp_thermal
  driver, and a couple of small fixes.

  Highlights:

   - move the ti-soc-thermal driver out of the staging tree to the
     thermal tree.

   - introduce the x86_pkg_temp_thermal driver.  This driver registers
     CPU digital temperature package level sensor as a thermal zone.

   - small fixes/cleanups including removing redundant use of
     platform_set_drvdata() and of_match_ptr for all platform thermal
     drivers"

* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (34 commits)
  thermal: cpu_cooling: fix stub function
  thermal: ti-soc-thermal: use standard GPIO DT bindings
  thermal: MAINTAINERS: Add git tree path for SoC specific updates
  thermal: fix x86_pkg_temp_thermal.c build and Kconfig
  Thermal: Documentation for x86 package temperature thermal driver
  Thermal: CPU Package temperature thermal
  thermal: consider emul_temperature while computing trend
  thermal: ti-soc-thermal: add DT example for DRA752 chip
  thermal: ti-soc-thermal: add dra752 chip to device table
  thermal: ti-soc-thermal: add thermal data for DRA752 chips
  thermal: ti-soc-thermal: remove usage of IS_ERR_OR_NULL
  thermal: ti-soc-thermal: freeze FSM while computing trend
  thermal: ti-soc-thermal: remove external heat while extrapolating hotspot
  thermal: ti-soc-thermal: update DT reference for OMAP5430
  x86, mcheck, therm_throt: Process package thresholds
  thermal: cpu_cooling: fix 'descend' check in get_property()
  Thermal: spear: Remove redundant use of of_match_ptr
  Thermal: kirkwood: Remove redundant use of of_match_ptr
  Thermal: dove: Remove redundant use of of_match_ptr
  Thermal: armada: Remove redundant use of of_match_ptr
  ...

Thermal: Documentation for x86 package temperature thermal driver

2013-06-17T22:27:57+00:00

Added documentation describing details of the x86 package temperature
thermal driver.

Signed-off-by: Srinivas Pandruvada 
Signed-off-by: Zhang Rui

doc: fix misspellings with 'codespell' tool

2013-05-28T10:02:12+00:00

Signed-off-by: Anatol Pomozov 
Signed-off-by: Jiri Kosina

Thermal: update documentation for thermal_zone_device_register

2013-04-27T01:16:04+00:00

Update kernel Documentation for thermal_zone_device_register.

Signed-off-by: Zhang Rui

thermal: rename notify_thermal_framework to thermal_notify_framework

2013-04-24T16:56:16+00:00

To follow the prefix names used by the thermal functions,
this patch renames notify_thermal_framework to thermal_notify_framework.

Signed-off-by: Eduardo Valentin 
Signed-off-by: Zhang Rui

Thermal: build thermal governors into thermal_sys module

2013-04-14T15:28:43+00:00

The thermal governors are part of the thermal framework,
rather than a seperate feature/module.
Because the generic thermal layer can not work without
thermal governors, and it must load the thermal governors
during its initialization.

Build them into one module in this patch.

This also fix a problem that the generic thermal layer does not
work when CONFIG_THERMAL=m and CONFIG_THERMAL_GOV_XXX=y.

Signed-off-by: Zhang Rui 
Acked-by: Eduardo Valentin 
Acked-by: Durgadoss R

thermal: add a warning for temperature emulation feature

2013-04-02T13:34:42+00:00

Because this feature is for debuging purposes, it is highly
recommended to do not enable this on production systems.
This patch adds warnings for system integrators, so that
people are aware of this potential security issue.

Signed-off-by: Eduardo Valentin 
Signed-off-by: Zhang Rui