Pull more thermal control updates from Rafael Wysocki:
 "This mostly consists of assorted updates of thermal drivers, including
  new hardware support (Airoha AN7583, Qualcomm Master BandGap thermal
  monitor, QCom PMIC5 Gen3 ADC), but it also includes two reverts of
  recent cosmetic thermal core updates that went against driver core
  plans to eliminate class_create():

   - Fix missing bitfield include headers in Armada and QCom SPM BMG
     drivers (Daniel Lezcano)

   - Fix missed file when manually applying a change after a conflict
     resolution for the QCom SPMI ADC TM5 Gen3 (Daniel Lezcano)

   - Move thermal_zone_device_enable() to the right place in order to
     prevent calling it if the thermal zone registration failed (Dan
     Carpenter)

   - Improve bitfield manipulations on Armada (Bryan B. Lima)

   - Remove unneeded 'fast_io' on Sun8i and Armada (Wolfram Sang)

   - Fix wrong boundary when clamping the low values in the set_trips()
     callback and fix wrong mask when setting the temperature interval
     on Airoha (Christian Marangi)

   - Make use of the regmap API to support Airoha AN7583 (Christian
     Marangi)

   - Fix adc_tm5_get_temp() return check value on the QCom SPMI ADC
     sensor (Rakesh Kota)

   - Fix unbalanced clock enablement when the resume fails on the iMX
     driver (Can Peng)

   - Add Qualcomm Master BandGap thermal monitor support (Satya Priya
     Kakitapalli)

   - Add Maili Temperature bindings compatible (Haritha S K)

   - Add a devm action to clean hardware interrupts, sampling, and
     control registers on Spacemit K1 (Pei Xiao)

   - Fix trivial typo in a thermal OF code comment (Marek Vasut)

   - Remove unnecessary print on Qcom SPMI ADC driver when a call to
     devm_request_threaded_irq() fails as this one already prints a
     message (Jishnu Prakash)

   - Add support for QCom PMIC5 Gen3 ADC by using auxiliary driver and
     shared interrupt with the IIO driver (Jishnu Prakash)

   - Make resets optional on MT8196 and add the corresponding property
     in the DT bindings (AngeloGioacchino Del Regno)

   - Fix clock staying enabled on failing resume operation on Qoriq (Can
     Peng)

   - Fix wrong closing brace position in thermal library header (Andreas
     Haufler)

   - Fix low and high trip point validation by moving the check after
     the clamp on the spacemit driver (surendra)

   - Remove redundant error messages on IRQ request failure (Pan Chuang)

   - Add IIO_CONSUMER namespace import to the qcom-spmi-mbg-tm thermal
     driver to avoid modpost warnings that would appear after merging
     the iio tree against the thermal updates (Nathan Chancellor)

   - Revert two recent cosmetic updates of the thermal core conflicting
     with driver core plans to eliminate class_create() (Rafael
     Wysocki)"

* tag 'thermal-7.3-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm: (32 commits)
  thermal/drivers/qcom-spmi-mbg-tm: Add module namespace import for IIO_CONSUMER
  Revert "thermal/core: Allocate the thermal class dynamically"
  Revert "thermal/core: Use the thermal class pointer as init guard"
  thermal/drivers/armada: Fix missing bitfields include
  thermal/drivers/qcom/spm mbg tm: Fix missing bitfield header
  thermal/drivers/qcom: Fix missing spmi adc tm5 gen3 file
  thermal/drivers: Remove redundant error messages on IRQ request failure
  thermal/drivers/spacemit: Validate clamped trip thresholds
  tools/lib/thermal: Fix misplaced extern "C" closing brace
  thermal/drivers/qoriq: Disable clock on resume failure
  thermal/drivers/mediatek/lvts_thermal: Make reset optional for MT8196
  dt-bindings: thermal: mediatek: Make resets optional for MT8196
  thermal/drivers/qcom: add support for PMIC5 Gen3 ADC thermal monitoring
  iio: adc: qcom-spmi-adc5-gen3: Share SDAM0 IRQ with ADC_TM auxiliary driver
  iio: adc: qcom-spmi-adc5-gen3: Remove an unnecessary print
  thermal/of: Fix trivial enabled typo
  thermal/drivers/spacemit/k1: Add shutdown action and reorder registration order
  dt-bindings: thermal: qcom-tsens: Document the Maili Temperature Sensor
  thermal/drivers/qcom: Add support for Qualcomm MBG thermal monitoring
  dt-bindings: thermal: Add Qualcomm MBG thermal monitor support
  ...

Both LVTS-AP and LVTS-MCU may be shared with SoC-internal MCUs
running some sort of firmware that checks thermals in order to
scale frequency, or to take action for critical SoC thermal
protection - and this is seen on most MT8196 boards.

Make resets optional, as doing a HW reset on such boards will
result in either an immediate thermal protect shutdown or in
a rather important and usually permanent system slowdown.

Signed-off-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Reviewed-by: Chen-Yu Tsai <wenst@chromium.org>
Link: https://patch.msgid.link/20260721105230.101906-2-angelogioacchino.delregno@collabora.com

Document the Temperature Sensor (TSENS) on the Qualcomm Maili SoC.

Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Signed-off-by: Haritha S K <haritha.k@oss.qualcomm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Link: https://patch.msgid.link/20260619-b4-maili-upstream-3-v2-1-e54516c37022@oss.qualcomm.com

Add bindings for the Qualcomm MBG (Master Bandgap) temperature alarm
peripheral found on the PM8775 PMIC. Unlike the existing SPMI temp alarm
peripheral, the MBG peripheral supports both hot and cold threshold
monitoring across two programmable levels (LVL1 and LVL2), with interrupt
status reported via a fault status register over SPMI.

Signed-off-by: Satya Priya Kakitapalli <quic_skakitap@quicinc.com>
Co-developed-by: Sachin Gupta <sachin.gupta@oss.qualcomm.com>
Signed-off-by: Sachin Gupta <sachin.gupta@oss.qualcomm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Link: https://patch.msgid.link/20260722-spmi-mbg-driver-v3-1-ef73064f2789@oss.qualcomm.com

There is no use of double colon '::' in YAML. OTOH, the literal style
block, e.g. using '|' treats all characters as content [1] therefore
single use of ':' in descriptions is perfectly fine, whenever '|' is
used.

Cleanup existing code, so the confusing style won't be re-used in new
contributions.

Link: https://yaml.org/spec/1.2.2/#literal-style [1]
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Acked-by: Alim Akhtar <alim.akhtar@samsung.com>
Acked-by: Sebastian Reichel <sebastian.reichel@collabora.com>
Acked-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Acked-by: Mark Brown <broonie@kernel.org>
Acked-by: Geert Uytterhoeven <geert+renesas@glider.be> # renesas
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Acked-by: Andi Shyti <andi.shyti@kernel.org>
Link: https://patch.msgid.link/20260623054842.21831-4-krzysztof.kozlowski@oss.qualcomm.com
Signed-off-by: Rob Herring (Arm) <robh@kernel.org>

The example DTS is tested in a wrapped node with address/size-cells=1,
thus reg had incorrect entry leading to dt_binding_check fails:

  thermal/amlogic,thermal.example.dtb: temperature-sensor@20000 (amlogic,t7-thermal): reg: [[0, 131072], [0, 80]] is too long

Fixes: b1c8ccdbd4e9 ("dt-bindings: thermal: amlogic: Add support for T7")
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Link: https://patch.msgid.link/20260622100231.438435-4-krzysztof.kozlowski@oss.qualcomm.com
Signed-off-by: Rob Herring (Arm) <robh@kernel.org>

Usage of defines from headers requires including relevant header,
otherwise dt_binding_check fails:

  Lexical error: Documentation/devicetree/bindings/thermal/amlogic,thermal.example.dts:59.27-34 Unexpected 'GIC_SPI'
  Lexical error: Documentation/devicetree/bindings/thermal/amlogic,thermal.example.dts:59.38-57 Unexpected 'IRQ_TYPE_LEVEL_HIGH'
  Lexical error: Documentation/devicetree/bindings/thermal/amlogic,thermal.example.dts:60.37-45 Unexpected 'CLKID_TS'

Fixes: b1c8ccdbd4e9 ("dt-bindings: thermal: amlogic: Add support for T7")
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Link: https://patch.msgid.link/20260622100231.438435-3-krzysztof.kozlowski@oss.qualcomm.com
Signed-off-by: Rob Herring (Arm) <robh@kernel.org>

Extend the thermal cooling device binding to support a 3 cells specifier
along with the 2 cells format.

Update #cooling-cells property to enum to support both 2 and 3 arguments.

Fix pwm-fan.yaml to restrict the number of cells to 'const: 2'

Signed-off-by: Gaurav Kohli <gaurav.kohli@oss.qualcomm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Acked-by: Rafael J. Wysocki (Intel) <rafael@kernel.org>
Link: https://patch.msgid.link/20260526140802.1059293-22-daniel.lezcano@oss.qualcomm.com

Add i.MX93 compatible string 'fsl,imx93-tmu' because Thermal monitor
unit(TMU) on i.MX93 has differences with QorIQ platform and not fully
compatible with existing Platform, such as fsl,qoriq-tmu.

Signed-off-by: Jacky Bai <ping.bai@nxp.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Tested-by: Alexander Stein <alexander.stein@ew.tq-group.com>
Reviewed-by: Frank Li <Frank.Li@nxp.com>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://patch.msgid.link/20260430-imx93_tmu-v6-1-485459d7b54f@nxp.com

Document the SpacemiT K1 Thermal Sensor, which supports
monitoring temperatures for five zones: soc, package, gpu, cluster0,
and cluster1.

Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Signed-off-by: Shuwei Wu <shuwei.wu@mailbox.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.or>
Link: https://patch.msgid.link/20260427-k1-thermal-v5-1-df39187480ed@mailbox.org