linux.git/Documentation/devicetree/bindings/thermal, branch master Linux kernel source tree Merge tag 'mfd-next-7.1' of git://git.kernel.org/pub/scm/linux/kernel/git/lee/mfd 2026-04-20T18:31:01+00:00 Linus Torvalds torvalds@linux-foundation.org 2026-04-20T18:31:01+00:00 25c456dab5e7bf3ed39155ccbc8465928137c0be Pull MFD updates from Lee Jones: "Core: - Add a resource-managed version of alloc_workqueue() (`devm_alloc_workqueue()`) - Preserve the Open Firmware (OF) node when an ACPI handle is present Apple SMC: - Wire up the Apple SMC power driver by adding a new MFD cell Atmel HLCDC: - Fetch the LVDS PLL clock as a fallback if the generic sys_clk is unavailable Broadcom BCM2835 PM: - Add support for the BCM2712 power management device - Introduce a hardware type identifier to distinguish SoC variants Congatec CGBC, KEMPLD, RSMU, Si476x: - Fix various kernel-doc warnings and correct struct member names DLN2: - Drop redundant USB device references and switch to managed resource allocations - Update bare 'unsigned' types to 'unsigned int' ENE KB3930: - Use the of_device_is_system_power_controller() wrapper EZX PCAP: - Avoid rescheduling after destroying the workqueue by switching to a device-managed workqueue - Drop redundant memory allocation error messages - Return directly instead of using empty goto statements Freescale i.MX25 TSADC: - Convert devicetree bindings from TXT to YAML format Freescale MC13xxx: - Fix a memory leak in subdevice platform data allocation by using devm_kmemdup() Intel LPC ICH: - Expose a software node for the GPIO controller cell to fix GPIO lookups Intel LPSS: - Add PCI IDs for the Intel Nova Lake-H platform Maxim MAX77620: - Convert devicetree bindings from TXT to YAML format - Document an optional I2C address for the MAX77663 RTC device Maxim MAX77705: - Make the max77705_pm_ops variable static to resolve a sparse warning MediaTek MT6397: - Correct the hardware CIDs for the MT6328, MT6331, and MT6332 PMICs to allow proper driver binding ROHM BD71828: - Enable system wakeup via the power button ROHM BD72720: - Add a new compatible string for the ROHM BD73900 PMIC SpacemiT P1: - Drop the deprecated "vin-supply" property from the devicetree bindings - Add individual regulator supply properties to match actual hardware topology STMicroelectronics STPMIC1: - Attempt system shutdown a second time to handle transient I2C communication failures Viperboard: - Drop redundant USB device references" * tag 'mfd-next-7.1' of git://git.kernel.org/pub/scm/linux/kernel/git/lee/mfd: (28 commits) mfd: core: Preserve OF node when ACPI handle is present mfd: ene-kb3930: Use of_device_is_system_power_controller() wrapper mfd: intel-lpss: Add Intel Nova Lake-H PCI IDs dt-bindings: mfd: max77620: Document optional RTC address for MAX77663 dt-bindings: mfd: max77620: Convert to DT schema mfd: ezx-pcap: Avoid rescheduling after destroying workqueue mfd: ezx-pcap: Return directly instead of empty gotos mfd: ezx-pcap: Drop memory allocation error message mfd: bcm2835-pm: Add BCM2712 PM device support mfd: bcm2835-pm: Introduce SoC-specific type identifier dt-bindings: mfd: bd72720: Add ROHM BD73900 mfd: si476x: Fix kernel-doc warnings mfd: rsmu: Remove a empty kernel-doc line mfd: kempld: Fix kernel-doc struct member names mfd: congatec: Fix kernel-doc struct member names dt-bindings: mfd: Convert fsl-imx25-tsadc.txt to yaml format mfd: viperboard: Drop redundant device reference mfd: dln2: Switch to managed resources and fix bare unsigned types mfd: macsmc: Wire up Apple SMC power driver mfd: mt6397: Properly fix CID of MT6328, MT6331 and MT6332 ... 
Pull MFD updates from Lee Jones:
 "Core:
   - Add a resource-managed version of alloc_workqueue()
     (`devm_alloc_workqueue()`)
   - Preserve the Open Firmware (OF) node when an ACPI handle
     is present

  Apple SMC:
   - Wire up the Apple SMC power driver by adding a new MFD cell

  Atmel HLCDC:
   - Fetch the LVDS PLL clock as a fallback if the generic sys_clk
     is unavailable

  Broadcom BCM2835 PM:
   - Add support for the BCM2712 power management device
   - Introduce a hardware type identifier to distinguish SoC variants

  Congatec CGBC, KEMPLD, RSMU, Si476x:
   - Fix various kernel-doc warnings and correct struct member names

  DLN2:
   - Drop redundant USB device references and switch to managed
     resource allocations
   - Update bare 'unsigned' types to 'unsigned int'

  ENE KB3930:
   - Use the of_device_is_system_power_controller() wrapper

  EZX PCAP:
   - Avoid rescheduling after destroying the workqueue by switching
     to a device-managed workqueue
   - Drop redundant memory allocation error messages
   - Return directly instead of using empty goto statements

  Freescale i.MX25 TSADC:
   - Convert devicetree bindings from TXT to YAML format

  Freescale MC13xxx:
   - Fix a memory leak in subdevice platform data allocation by
     using devm_kmemdup()

  Intel LPC ICH:
   - Expose a software node for the GPIO controller cell to fix
     GPIO lookups

  Intel LPSS:
   - Add PCI IDs for the Intel Nova Lake-H platform

  Maxim MAX77620:
   - Convert devicetree bindings from TXT to YAML format
   - Document an optional I2C address for the MAX77663 RTC device

  Maxim MAX77705:
   - Make the max77705_pm_ops variable static to resolve a
     sparse warning

  MediaTek MT6397:
   - Correct the hardware CIDs for the MT6328, MT6331, and MT6332
     PMICs to allow proper driver binding

  ROHM BD71828:
   - Enable system wakeup via the power button

  ROHM BD72720:
   - Add a new compatible string for the ROHM BD73900 PMIC

  SpacemiT P1:
   - Drop the deprecated "vin-supply" property from the devicetree
     bindings
   - Add individual regulator supply properties to match actual
     hardware topology

  STMicroelectronics STPMIC1:
   - Attempt system shutdown a second time to handle transient I2C
     communication failures

  Viperboard:
   - Drop redundant USB device references"

* tag 'mfd-next-7.1' of git://git.kernel.org/pub/scm/linux/kernel/git/lee/mfd: (28 commits)
  mfd: core: Preserve OF node when ACPI handle is present
  mfd: ene-kb3930: Use of_device_is_system_power_controller() wrapper
  mfd: intel-lpss: Add Intel Nova Lake-H PCI IDs
  dt-bindings: mfd: max77620: Document optional RTC address for MAX77663
  dt-bindings: mfd: max77620: Convert to DT schema
  mfd: ezx-pcap: Avoid rescheduling after destroying workqueue
  mfd: ezx-pcap: Return directly instead of empty gotos
  mfd: ezx-pcap: Drop memory allocation error message
  mfd: bcm2835-pm: Add BCM2712 PM device support
  mfd: bcm2835-pm: Introduce SoC-specific type identifier
  dt-bindings: mfd: bd72720: Add ROHM BD73900
  mfd: si476x: Fix kernel-doc warnings
  mfd: rsmu: Remove a empty kernel-doc line
  mfd: kempld: Fix kernel-doc struct member names
  mfd: congatec: Fix kernel-doc struct member names
  dt-bindings: mfd: Convert fsl-imx25-tsadc.txt to yaml format
  mfd: viperboard: Drop redundant device reference
  mfd: dln2: Switch to managed resources and fix bare unsigned types
  mfd: macsmc: Wire up Apple SMC power driver
  mfd: mt6397: Properly fix CID of MT6328, MT6331 and MT6332
  ...
Merge tag 'devicetree-for-7.1' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux 2026-04-17T21:09:02+00:00 Linus Torvalds torvalds@linux-foundation.org 2026-04-17T21:09:02+00:00 e2d10998e4293a27c0389870b5fdf736a71d61ef Pull devicetree updates from Rob Herring: "DT core: - Cleanup of the reserved memory code to keep CMA specifics in CMA code - Add and convert several users to new of_machine_get_match() helper - Validate nul termination in string properties - Update dtc to upstream v1.7.2-69-g53373d135579 - Limit matching reserved memory devices to /reserved-memory nodes - Fix some UAF in unittests - Remove Baikal SoC bus driver - Fix false DT_SPLIT_BINDING_PATCH checkpatch warning - Allow fw_devlink device-tree on x86 - Fix kerneldoc return description for of_property_count_elems_of_size() DT bindings: - Add fsl,imx25-aips, fsl,imx25-tcq, qcom,eliza-pdc, qcom,eliza-spmi-pmic-arb, qcom,hawi-imem, qcom,milos-imem, qcom,hawi-pdc, and lg,sw49410 bindings - Convert arm,vexpress-scc to DT schema - Deprecate Qualcomm generic CPU compatibles. Add Apple M3 CPU cores. - Move some dual-link display panels to the dual-link schema - Drop mux controller node name constraints - Remove Baikal SoC bus bindings - Fix a false warning in the thermal trip node binding" * tag 'devicetree-for-7.1' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (39 commits) dt-bindings: display: panel: panel-simple: Add lg,sw49410 compatible dt-bindings: display: ti, am65x-dss: Fix AM62L DSS reg and clock constraints dt-bindings: display: simple: Move Innolux G156HCE-L01 panel to dual-link dt-bindings: display: simple: Move AUO 21.5" FHD to dual-link dt-bindings: thermal: Fix false warning with 'phandle' in trips nodes of: unittest: fix use-after-free in testdrv_probe() of: unittest: fix use-after-free in of_unittest_changeset() dt-bindings: qcom,pdc: document the Hawi Power Domain Controller dt-bindings: ARM: arm,vexpress-scc: convert to DT schema drivers/of: fdt: validate flat DT string properties before string use drivers/of: fdt: validate stdout-path properties before parsing them dt-bindings: sram: Document qcom,hawi-imem compatible dt-bindings: sram: Allow multiple-word prefixes to sram subnode dt-bindings: sram: Document qcom,milos-imem scripts/dtc: Update to upstream version v1.7.2-69-g53373d135579 of: property: Allow fw_devlink device-tree on x86 dt-bindings: arm: cpus: Add Apple M3 CPU core compatibles dt-bindings: display: lt8912b: Drop redundant endpoint properties dt-bindings: opp-v2: Fix example 3 CPU reg value dt-bindings: connector: add pd-disable dependency ... 
Pull devicetree updates from Rob Herring:
 "DT core:

   - Cleanup of the reserved memory code to keep CMA specifics in CMA
     code

   - Add and convert several users to new of_machine_get_match() helper

   - Validate nul termination in string properties

   - Update dtc to upstream v1.7.2-69-g53373d135579

   - Limit matching reserved memory devices to /reserved-memory nodes

   - Fix some UAF in unittests

   - Remove Baikal SoC bus driver

   - Fix false DT_SPLIT_BINDING_PATCH checkpatch warning

   - Allow fw_devlink device-tree on x86

   - Fix kerneldoc return description for of_property_count_elems_of_size()

  DT bindings:

   - Add fsl,imx25-aips, fsl,imx25-tcq, qcom,eliza-pdc,
     qcom,eliza-spmi-pmic-arb, qcom,hawi-imem, qcom,milos-imem,
     qcom,hawi-pdc, and lg,sw49410 bindings

   - Convert arm,vexpress-scc to DT schema

   - Deprecate Qualcomm generic CPU compatibles. Add Apple M3 CPU cores.

   - Move some dual-link display panels to the dual-link schema

   - Drop mux controller node name constraints

   - Remove Baikal SoC bus bindings

   - Fix a false warning in the thermal trip node binding"

* tag 'devicetree-for-7.1' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (39 commits)
  dt-bindings: display: panel: panel-simple: Add lg,sw49410 compatible
  dt-bindings: display: ti, am65x-dss: Fix AM62L DSS reg and clock constraints
  dt-bindings: display: simple: Move Innolux G156HCE-L01 panel to dual-link
  dt-bindings: display: simple: Move AUO 21.5" FHD to dual-link
  dt-bindings: thermal: Fix false warning with 'phandle' in trips nodes
  of: unittest: fix use-after-free in testdrv_probe()
  of: unittest: fix use-after-free in of_unittest_changeset()
  dt-bindings: qcom,pdc: document the Hawi Power Domain Controller
  dt-bindings: ARM: arm,vexpress-scc: convert to DT schema
  drivers/of: fdt: validate flat DT string properties before string use
  drivers/of: fdt: validate stdout-path properties before parsing them
  dt-bindings: sram: Document qcom,hawi-imem compatible
  dt-bindings: sram: Allow multiple-word prefixes to sram subnode
  dt-bindings: sram: Document qcom,milos-imem
  scripts/dtc: Update to upstream version v1.7.2-69-g53373d135579
  of: property: Allow fw_devlink device-tree on x86
  dt-bindings: arm: cpus: Add Apple M3 CPU core compatibles
  dt-bindings: display: lt8912b: Drop redundant endpoint properties
  dt-bindings: opp-v2: Fix example 3 CPU reg value
  dt-bindings: connector: add pd-disable dependency
  ...
dt-bindings: thermal: Fix false warning with 'phandle' in trips nodes 2026-04-16T12:27:18+00:00 Rob Herring (Arm) robh@kernel.org 2026-04-10T22:17:53+00:00 5d0e969c4e6ab4c4693f7a4c381e30125106f73d A pattern property matching essentially anything doesn't work if there are implicit properties such as 'phandle' which can occur on any node. One such example popped up recently: arch/arm64/boot/dts/qcom/sm8650-hdk.dtb: thermal-zones: gpuss0-thermal:trips:phandle: 531 is not of type 'object' from schema $id: http://devicetree.org/schemas/thermal/thermal-zones.yaml Instead of a pattern property, use an "additionalProperties" schema instead which is the fallback in case of no matching property. Link: https://patch.msgid.link/20260410223601.1487473-2-robh@kernel.org Signed-off-by: Rob Herring (Arm) <robh@kernel.org> 
A pattern property matching essentially anything doesn't work if there
are implicit properties such as 'phandle' which can occur on any node.
One such example popped up recently:

arch/arm64/boot/dts/qcom/sm8650-hdk.dtb: thermal-zones: gpuss0-thermal:trips:phandle: 531 is not of type 'object'
        from schema $id: http://devicetree.org/schemas/thermal/thermal-zones.yaml

Instead of a pattern property, use an "additionalProperties" schema
instead which is the fallback in case of no matching property.

Link: https://patch.msgid.link/20260410223601.1487473-2-robh@kernel.org
Signed-off-by: Rob Herring (Arm) <robh@kernel.org>
dt-bindings: thermal: st,thermal-spear1340: convert to dtschema 2026-03-30T08:01:29+00:00 Gopi Krishna Menon krishnagopi487@gmail.com 2026-03-29T12:34:43+00:00 8f271fe15eaef9eeed6229a78adf6565cc554b63 Convert the SPEAr Thermal Sensor bindings to DT schema. Signed-off-by: Gopi Krishna Menon <krishnagopi487@gmail.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com> Acked-by: Viresh Kumar <viresh.kumar@linaro.org> Link: https://patch.msgid.link/20260329123449.309814-2-krishnagopi487@gmail.com 
Convert the SPEAr Thermal Sensor bindings to DT schema.

Signed-off-by: Gopi Krishna Menon <krishnagopi487@gmail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Link: https://patch.msgid.link/20260329123449.309814-2-krishnagopi487@gmail.com
dt-bindings: thermal: qcom-tsens: Add Eliza SoC TSENS 2026-03-27T10:25:15+00:00 Krzysztof Kozlowski krzysztof.kozlowski@oss.qualcomm.com 2026-03-27T10:07:34+00:00 85f18eddf0761c8f9d9af93251febf4b8813d659 Document the compatible for Qualcomm Eliza SoC TSENS module, fully compatible with TSENS v2 generation (e.g. SM8650). Acked-by: Rob Herring (Arm) <robh@kernel.org> Reviewed-by: Konrad Dybcio <konrad.dybcio@oss.qualcomm.com> Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com> Link: https://patch.msgid.link/20260327100733.365573-2-krzysztof.kozlowski@oss.qualcomm.com Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org> 
Document the compatible for Qualcomm Eliza SoC TSENS module, fully
compatible with TSENS v2 generation (e.g. SM8650).

Acked-by: Rob Herring (Arm) <robh@kernel.org>
Reviewed-by: Konrad Dybcio <konrad.dybcio@oss.qualcomm.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Link: https://patch.msgid.link/20260327100733.365573-2-krzysztof.kozlowski@oss.qualcomm.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
dt-bindings: mfd: max77620: Convert to DT schema 2026-03-25T12:46:02+00:00 Svyatoslav Ryhel clamor95@gmail.com 2026-03-12T08:52:56+00:00 4370650b6fdbb1bdc5762916ce08f6b2062c4fd1 Convert max77620 Device Tree bindings from TXT to YAML format. This patch does not change any functionality; the bindings remain the same. The thermal bindings are incorporated into the binding. GPIO controller function in MAX77620 has no dedicated node and is folded into the parent node itself. Signed-off-by: Svyatoslav Ryhel <clamor95@gmail.com> Acked-by: Daniel Lezcano <daniel.lezcano@kernel.org> Reviewed-by: Rob Herring (Arm) <robh@kernel.org> Link: https://patch.msgid.link/20260312085258.11431-4-clamor95@gmail.com Signed-off-by: Lee Jones <lee@kernel.org> 
Convert max77620 Device Tree bindings from TXT to YAML format. This patch
does not change any functionality; the bindings remain the same. The
thermal bindings are incorporated into the binding. GPIO controller
function in MAX77620 has no dedicated node and is folded into the parent
node itself.

Signed-off-by: Svyatoslav Ryhel <clamor95@gmail.com>
Acked-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Reviewed-by: Rob Herring (Arm) <robh@kernel.org>
Link: https://patch.msgid.link/20260312085258.11431-4-clamor95@gmail.com
Signed-off-by: Lee Jones <lee@kernel.org>
dt-bindings: thermal: qcom-tsens: Document the SM8750 Temperature Sensor 2026-03-14T10:45:46+00:00 Manaf Meethalavalappu Pallikunhi quic_manafm@quicinc.com 2026-03-13T10:34:17+00:00 9124e0e8f3fa39b32feb5cb756de10a265e9d8f0 Document the Temperature Sensor (TSENS) on the SM8750 SoC. Signed-off-by: Manaf Meethalavalappu Pallikunhi <quic_manafm@quicinc.com> Signed-off-by: Gaurav Kohli <gaurav.kohli@oss.qualcomm.com> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com> Link: https://patch.msgid.link/20260313-sm8750_tsens-v1-1-250fcc3794a2@oss.qualcomm.com Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org> 
Document the Temperature Sensor (TSENS) on the SM8750 SoC.

Signed-off-by: Manaf Meethalavalappu Pallikunhi <quic_manafm@quicinc.com>
Signed-off-by: Gaurav Kohli <gaurav.kohli@oss.qualcomm.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Link: https://patch.msgid.link/20260313-sm8750_tsens-v1-1-250fcc3794a2@oss.qualcomm.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
dt-bindings: thermal: lmh: Add SDM670 compatible 2026-03-10T10:17:49+00:00 Richard Acayan mailingradian@gmail.com 2026-03-10T00:20:36+00:00 a53a67b1fe94e4a4a3b05edb6bf52e74676e8de2 Document the SDM670 LMh. Signed-off-by: Richard Acayan <mailingradian@gmail.com> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com> Link: https://patch.msgid.link/20260310002037.1863-3-mailingradian@gmail.com Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org> 
Document the SDM670 LMh.

Signed-off-by: Richard Acayan <mailingradian@gmail.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Link: https://patch.msgid.link/20260310002037.1863-3-mailingradian@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
dt-bindings: thermal: tsens: add SDM670 compatible 2026-03-10T10:17:41+00:00 Richard Acayan mailingradian@gmail.com 2026-03-10T00:20:35+00:00 015c4506c356e3bf23b31fd68b913a53f32d4924 Add the compatible for the thermal sensors on the SDM670. Signed-off-by: Richard Acayan <mailingradian@gmail.com> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com> Link: https://patch.msgid.link/20260310002037.1863-2-mailingradian@gmail.com Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org> 
Add the compatible for the thermal sensors on the SDM670.

Signed-off-by: Richard Acayan <mailingradian@gmail.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Link: https://patch.msgid.link/20260310002037.1863-2-mailingradian@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
dt-bindings: thermal: r9a09g047-tsu: document RZ/T2H and RZ/N2H 2026-01-21T18:06:57+00:00 Cosmin Tanislav cosmin-gabriel.tanislav.xa@renesas.com 2026-01-08T19:52:22+00:00 f41eaaa5f2c9fb4fc816e45e2061d80c0b927d39 The Renesas RZ/T2H (R9A09G077) and RZ/N2H (R9A09G087) SoCs include a Temperature Sensor Unit (TSU). The device provides real-time temperature measurements for thermal management, utilizing a single dedicated channel for temperature sensing. Compared to the previously supported RZ/G3E, the RZ/T2H and RZ/N2H SoCs do not have a reset for the TSU peripheral, and the OTP data is exposed via ARM SMC, as opposed to a system register. Acked-by: Conor Dooley <conor.dooley@microchip.com> Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be> Signed-off-by: Cosmin Tanislav <cosmin-gabriel.tanislav.xa@renesas.com> Link: https://patch.msgid.link/20260108195223.193531-5-cosmin-gabriel.tanislav.xa@renesas.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> 
The Renesas RZ/T2H (R9A09G077) and RZ/N2H (R9A09G087) SoCs include a
Temperature Sensor Unit (TSU). The device provides real-time temperature
measurements for thermal management, utilizing a single dedicated
channel for temperature sensing.

Compared to the previously supported RZ/G3E, the RZ/T2H and RZ/N2H SoCs
do not have a reset for the TSU peripheral, and the OTP data is exposed
via ARM SMC, as opposed to a system register.

Acked-by: Conor Dooley <conor.dooley@microchip.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Cosmin Tanislav <cosmin-gabriel.tanislav.xa@renesas.com>
Link: https://patch.msgid.link/20260108195223.193531-5-cosmin-gabriel.tanislav.xa@renesas.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>