Pull MFD updates from Lee Jones:
 "New Support & Features:
   - MediaTek MT6397: Add mt6323 AUXADC support
   - MediaTek MT6397: Add mt6323 EFUSE support
   - Spreadtrum SC27xx: Add SC2730 regulator cell

  Improvements & Fixes:
   - Apple SMC: Fix key count endianness annotation
   - Azoteq IQS62x: Reject zero-length firmware records
   - ChromeOS EC: Introduce cros_ec_read_features helper and read
     features during probe to catch transfer errors
   - Cirrus Logic CS42L43: Fix regmap defaults ordering
   - Cirrus Logic CS42L43: Remove redundant NULL checks on SoundWire
   - Congatec Board Controller: Fix teardown ordering in cgbc_remove()
   - HP iPAQ Micro: Fix out-of-bounds stack read in ipaq_micro_str
   - Marvell 88PM886: Initialize the battery page
   - QNAP MCU: Keep the reply buffer alive past a command timeout
   - RAVE SP: Validate received frame payload lengths
   - Silicon Labs Si476x: Drop duplicate NULL checks
   - Silicon Labs Si476x: Modernize GPIO handling
   - Silicon Motion SM501: Fix potential memory leaks during remove
   - UCB1x00: Convert Assabet gpio-keys to use software nodes and
     register software node for GPIO controller
   - Viperboard: Fix native fields type in structures as little-endian
   - Viperboard: Remove redundant NULL check before kfree()
   - X-Powers AXP20x: Preserve other control bits when powering off

  Cleanups & Refactoring:
   - Core: Drop unused assignment of spi_device_id driver data
   - Core: Initialize spi_device_id arrays using member names
   - Core: Unify style of spi_device_id arrays
   - Maintainers: Add Intel LPSS section to follow the changes
   - Maintainers: Add a mailing list entry to MFD
   - Cirrus Logic CS42L43: Format sdw_device_id table
   - Cirrus Logic CS42L43: Use new SoundWire enumeration helper
   - ROHM PMIC: Factor out power button registration and convert
     gpio-keys to use software nodes
   - ST-Ericsson DB8500: Fold dbx500 header into db8500

  Device Tree Binding Updates:
   - Core: Add techvision vendor prefix
   - Marvell 88PM886: Allow vbus regulator
   - MediaTek MT8195 SCP: Add support for MT8189 SoC
   - Qualcomm SPMI PMIC: Document PMG1110
   - Qualcomm SPMI PMIC: Document haptics device
   - Qualcomm TCSR: Add compatible for Hawi and Maili SoCs
   - Qualcomm TCSR: Add compatible for Shikra
   - Qualcomm TCSR: Document the IPQ9650 TCSR block
   - STMicroelectronics STMPE: Fix typo st,stmpe601 (should be
     st,stmpe610)
   - Syscon: Add ESWIN EIC7700 compatible
   - Syscon: Allow syscon compatible for Loongson-2K0300 chip id
   - Syscon: Disallow simple-bus with syscon
   - Syscon: Drop custom select for older dtschema
   - TI OMAP USBHS TLL: Convert to DT schema"

* tag 'mfd-next-7.3' of git://git.kernel.org/pub/scm/linux/kernel/git/lee/mfd: (45 commits)
  mfd: cs42l43: Fix regmap defaults ordering
  dt-bindings: mfd: syscon: Allow syscon compatible for Loongson-2K0300 chip id
  dt-bindings: mfd: syscon: Add ESWIN EIC7700 compatible
  mfd: qnap-mcu: keep the reply buffer alive past a command timeout
  dt-bindings: mfd: qcom,tcsr: Document the IPQ9650 TCSR block
  mfd: macsmc: Fix key count endianness annotation
  dt-bindings: mfd: qcom,spmi-pmic: Document haptics device
  mfd: iqs62x: Reject zero-length firmware records
  mfd: rave-sp: validate received frame payload lengths
  mfd: sm501: Fix potential memory leaks during remove
  mfd: viperboard: Fix native fields type in structures as little-endian
  mfd: si476x-i2c: Get rid of duplicate NULL checks
  dt-bindings: mfd: Convert OMAP USB TLL to DT schema
  mfd: cgbc: Fix teardown ordering in cgbc_remove()
  mfd: mt6397-core: Add mt6323 AUXADC support
  dt-bindings: mfd: qcom,tcsr: Add compatible for Hawi and Maili SoCs
  mfd: rohm: Factor out power button registration
  mfd: ucb1x00: Convert Assabet gpio-keys to use software nodes
  mfd: ucb1x00: Register software node for GPIO controller
  mfd: cs42l43: Tidy up formatting on sdw_device_id table
  ...

Pull more thermal control updates from Rafael Wysocki:
 "This mostly consists of assorted updates of thermal drivers, including
  new hardware support (Airoha AN7583, Qualcomm Master BandGap thermal
  monitor, QCom PMIC5 Gen3 ADC), but it also includes two reverts of
  recent cosmetic thermal core updates that went against driver core
  plans to eliminate class_create():

   - Fix missing bitfield include headers in Armada and QCom SPM BMG
     drivers (Daniel Lezcano)

   - Fix missed file when manually applying a change after a conflict
     resolution for the QCom SPMI ADC TM5 Gen3 (Daniel Lezcano)

   - Move thermal_zone_device_enable() to the right place in order to
     prevent calling it if the thermal zone registration failed (Dan
     Carpenter)

   - Improve bitfield manipulations on Armada (Bryan B. Lima)

   - Remove unneeded 'fast_io' on Sun8i and Armada (Wolfram Sang)

   - Fix wrong boundary when clamping the low values in the set_trips()
     callback and fix wrong mask when setting the temperature interval
     on Airoha (Christian Marangi)

   - Make use of the regmap API to support Airoha AN7583 (Christian
     Marangi)

   - Fix adc_tm5_get_temp() return check value on the QCom SPMI ADC
     sensor (Rakesh Kota)

   - Fix unbalanced clock enablement when the resume fails on the iMX
     driver (Can Peng)

   - Add Qualcomm Master BandGap thermal monitor support (Satya Priya
     Kakitapalli)

   - Add Maili Temperature bindings compatible (Haritha S K)

   - Add a devm action to clean hardware interrupts, sampling, and
     control registers on Spacemit K1 (Pei Xiao)

   - Fix trivial typo in a thermal OF code comment (Marek Vasut)

   - Remove unnecessary print on Qcom SPMI ADC driver when a call to
     devm_request_threaded_irq() fails as this one already prints a
     message (Jishnu Prakash)

   - Add support for QCom PMIC5 Gen3 ADC by using auxiliary driver and
     shared interrupt with the IIO driver (Jishnu Prakash)

   - Make resets optional on MT8196 and add the corresponding property
     in the DT bindings (AngeloGioacchino Del Regno)

   - Fix clock staying enabled on failing resume operation on Qoriq (Can
     Peng)

   - Fix wrong closing brace position in thermal library header (Andreas
     Haufler)

   - Fix low and high trip point validation by moving the check after
     the clamp on the spacemit driver (surendra)

   - Remove redundant error messages on IRQ request failure (Pan Chuang)

   - Add IIO_CONSUMER namespace import to the qcom-spmi-mbg-tm thermal
     driver to avoid modpost warnings that would appear after merging
     the iio tree against the thermal updates (Nathan Chancellor)

   - Revert two recent cosmetic updates of the thermal core conflicting
     with driver core plans to eliminate class_create() (Rafael
     Wysocki)"

* tag 'thermal-7.3-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm: (32 commits)
  thermal/drivers/qcom-spmi-mbg-tm: Add module namespace import for IIO_CONSUMER
  Revert "thermal/core: Allocate the thermal class dynamically"
  Revert "thermal/core: Use the thermal class pointer as init guard"
  thermal/drivers/armada: Fix missing bitfields include
  thermal/drivers/qcom/spm mbg tm: Fix missing bitfield header
  thermal/drivers/qcom: Fix missing spmi adc tm5 gen3 file
  thermal/drivers: Remove redundant error messages on IRQ request failure
  thermal/drivers/spacemit: Validate clamped trip thresholds
  tools/lib/thermal: Fix misplaced extern "C" closing brace
  thermal/drivers/qoriq: Disable clock on resume failure
  thermal/drivers/mediatek/lvts_thermal: Make reset optional for MT8196
  dt-bindings: thermal: mediatek: Make resets optional for MT8196
  thermal/drivers/qcom: add support for PMIC5 Gen3 ADC thermal monitoring
  iio: adc: qcom-spmi-adc5-gen3: Share SDAM0 IRQ with ADC_TM auxiliary driver
  iio: adc: qcom-spmi-adc5-gen3: Remove an unnecessary print
  thermal/of: Fix trivial enabled typo
  thermal/drivers/spacemit/k1: Add shutdown action and reorder registration order
  dt-bindings: thermal: qcom-tsens: Document the Maili Temperature Sensor
  thermal/drivers/qcom: Add support for Qualcomm MBG thermal monitoring
  dt-bindings: thermal: Add Qualcomm MBG thermal monitor support
  ...

The Loongson-2K0300 SoC exposes its chip ID registers through a syscon
interface. Add the specific compatible `loongson,ls2k0300-chipid-syscon`
to the allowed list of syscon bindings so that it can be referenced from
the thermal node via a phandle.

Signed-off-by: Binbin Zhou <zhoubinbin@loongson.cn>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Link: https://patch.msgid.link/b76405a88b0cded91ba370139d7223fe2d6953df.1785829933.git.zhoubinbin@loongson.cn
Signed-off-by: Lee Jones <lee@kernel.org>

Document ESWIN EIC7700 SoC compatible for syscon registers.

Signed-off-by: Pinkesh Vaghela <pinkesh.vaghela@einfochips.com>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Link: https://patch.msgid.link/20260804104431.1391839-5-pinkesh.vaghela@einfochips.com
Signed-off-by: Lee Jones <lee@kernel.org>

Add bindings for the Qualcomm MBG (Master Bandgap) temperature alarm
peripheral found on the PM8775 PMIC. Unlike the existing SPMI temp alarm
peripheral, the MBG peripheral supports both hot and cold threshold
monitoring across two programmable levels (LVL1 and LVL2), with interrupt
status reported via a fault status register over SPMI.

Signed-off-by: Satya Priya Kakitapalli <quic_skakitap@quicinc.com>
Co-developed-by: Sachin Gupta <sachin.gupta@oss.qualcomm.com>
Signed-off-by: Sachin Gupta <sachin.gupta@oss.qualcomm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Link: https://patch.msgid.link/20260722-spmi-mbg-driver-v3-1-ef73064f2789@oss.qualcomm.com

Correct a few white-space issues, like double space after '=' or before
bracket '{' characters, which will be flagged by dt-check-style.  No
functional changes.

Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Acked-by: Jeff Johnson <jjohnson@kernel.org> # qcom,ath10k.yaml
Acked-by: Suzuki K Poulose <suzuki.poulose@arm.com>
Acked-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Acked-by: Uwe Kleine-König <ukleinek@kernel.org> # for Documentation/devicetree/bindings/pwm
Acked-by: Tomi Valkeinen <tomi.valkeinen@ideasonboard.com>
Acked-by: Andi Shyti <andi.shyti@kernel.org>
Link: https://patch.msgid.link/20260801195613.235430-2-krzysztof.kozlowski@oss.qualcomm.com
Signed-off-by: Rob Herring (Arm) <robh@kernel.org>

Document the TCSR block found on the Qualcomm's IPQ9650 SoC.

Signed-off-by: Kathiravan Thirumoorthy <kathiravan.thirumoorthy@oss.qualcomm.com>
Acked-by: Rob Herring (Arm) <robh@kernel.org>
Link: https://patch.msgid.link/20260727-ipq9650_tcsr_binding-v1-1-931ac0e056d0@oss.qualcomm.com
Signed-off-by: Lee Jones <lee@kernel.org>

Some of the Qualcomm SPMI PMIC has haptics device in it, add it in the
device list.

Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Signed-off-by: Fenglin Wu <fenglin.wu@oss.qualcomm.com>
Link: https://patch.msgid.link/20260804-qcom-spmi-haptics-v5-2-77128ebbdd2d@oss.qualcomm.com
Signed-off-by: Lee Jones <lee@kernel.org>

Convert the OMAP HS USB Host TLL bindings to DT schema.

During the conversion, ti,hwmods has been made optional to resolve
dtbs_check warnings. Modern OMAP platforms do not require this
property, but it is still required for older platforms.

Signed-off-by: Eduard Bostina <egbostina@gmail.com>
Reviewed-by: Rob Herring (Arm) <robh@kernel.org>
Link: https://patch.msgid.link/20260708123328.1768794-1-egbostina@gmail.com
Signed-off-by: Lee Jones <lee@kernel.org>

Document Top Control and Status Register (TCSR) controller for
Qualcomm Hawi and Maili SoCs.

Signed-off-by: Mukesh Ojha <mukesh.ojha@oss.qualcomm.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Link: https://patch.msgid.link/20260710192737.1689453-1-mukesh.ojha@oss.qualcomm.com
Signed-off-by: Lee Jones <lee@kernel.org>