linux-stable.git/drivers/thermal, branch v6.4.2

Revert "thermal/drivers/mediatek: Use devm_of_iomap to avoid resource leak in mtk_thermal_probe"

2023-07-01T11:12:41+00:00

commit 86edac7d3888c715fe3a81bd61f3617ecfe2e1dd upstream.

This reverts commit f05c7b7d9ea9477fcc388476c6f4ade8c66d2d26.

That change was causing a regression in the generic-adc-thermal-probed
bootrr test as reported in the kernelci-results list [1].
A proper rework will take longer, so revert it for now.

[1] https://groups.io/g/kernelci-results/message/42660

Fixes: f05c7b7d9ea9 ("thermal/drivers/mediatek: Use devm_of_iomap to avoid resource leak in mtk_thermal_probe")
Signed-off-by: Ricardo Cañuelo 
Suggested-by: AngeloGioacchino Del Regno 
Reviewed-by: AngeloGioacchino Del Regno 
Signed-off-by: Daniel Lezcano 
Link: https://lore.kernel.org/r/20230525121811.3360268-1-ricardo.canuelo@collabora.com
Signed-off-by: Greg Kroah-Hartman

thermal/intel/intel_soc_dts_iosf: Fix reporting wrong temperatures

2023-06-15T16:07:48+00:00

Since commit 955fb8719efb ("thermal/intel/intel_soc_dts_iosf: Use Intel
TCC library") intel_soc_dts_iosf is reporting the wrong temperature.

The driver expects tj_max to be in milli-degrees-celcius but after
the switch to the TCC library this is now in degrees celcius so
instead of e.g. 90000 it is set to 90 causing a temperature 45
degrees below tj_max to be reported as -44910 milli-degrees
instead of as 45000 milli-degrees.

Fix this by adding back the lost factor of 1000.

Fixes: 955fb8719efb ("thermal/intel/intel_soc_dts_iosf: Use Intel TCC library")
Reported-by: Bernhard Krug 
Signed-off-by: Hans de Goede 
Acked-by: Zhang Rui 
Cc: 6.3+  # 6.3+
Signed-off-by: Rafael J. Wysocki

thermal: intel: int340x: Add new line for UUID display

2023-05-24T17:50:04+00:00

Prior to the commit "763bd29fd3d1 ("thermal: int340x_thermal: Use
sysfs_emit_at() instead of scnprintf()", there was a new line after each
UUID string.

With the newline removed, existing user space like "thermald" fails to
compare each supported UUID as it is using getline() to read UUID and
apply correct thermal table.

To avoid breaking existing user space, add newline after each UUID string.

Signed-off-by: Srinivas Pandruvada 
Fixes: 763bd29fd3d1 ("thermal: int340x_thermal: Use sysfs_emit_at() instead of scnprintf()")
Cc: 6.3+  # 6.3+
Signed-off-by: Rafael J. Wysocki

thermal: intel: powerclamp: Fix NULL pointer access issue

2023-05-04T18:30:18+00:00

If cur_state for the powerclamp cooling device is set to the default
minimum state of 0, without setting first to cur_state > 0, this results
in NULL pointer access.

This NULL pointer access happens in the powercap core idle-inject
function idle_inject_set_duration() as there is no NULL check for
idle_inject_device pointer. This pointer must be allocated by calling
idle_inject_register() or idle_inject_register_full().

In the function powerclamp_set_cur_state(), idle_inject_device pointer
is allocated only when the cur_state > 0. But setting 0 without changing
to any other state, idle_inject_set_duration() will be called with a
NULL idle_inject_device pointer.

To address this, just return from powerclamp_set_cur_state() if the
current cooling device state is the same as the last one. Since the
power-up default cooling device state is 0, changing the state to 0
again here will return without calling idle_inject_set_duration().

Signed-off-by: Srinivas Pandruvada 
Fixes: 8526eb7fc75a ("thermal: intel: powerclamp: Use powercap idle-inject feature")
Bugzilla: https://bugzilla.kernel.org/show_bug.cgi?id=217386
Tested-by: Risto A. Paju 
Cc: 6.3+  # 6.3+
Signed-off-by: Rafael J. Wysocki

Merge tag 'thermal-6.4-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm

2023-05-03T18:46:01+00:00

Pull more thermal control updates from Rafael Wysocki:
 "These are mostly cleanups on top of the previously merged thermal
  control changes plus some driver fixes and the removal of the Intel
  Menlow thermal driver.

  Specifics:

   - Add compatible DT bindings for imx6sll and imx6ul to fix a dtbs
     check warning (Stefan Wahren)

   - Update the example in the DT bindings to reflect changes with the
     ADC node name for QCom TM and TM5 (Marijn Suijten)

   - Fix comments for the cpuidle_cooling_register() function to match
     the function prototype (Chenggang Wang)

   - Fix inconsistent temperature read and some Mediatek variant board
     reboot by reverting a change and handling the temperature
     differently (AngeloGioacchino Del Regno)

   - Fix a memory leak in the initialization error path for the Mediatek
     driver (Kang Chen)

   - Use of_address_to_resource() in the Mediatek driver (Rob Herring)

   - Fix unit address in the QCom tsens driver DT bindings (Krzysztof
     Kozlowski)

   - Clean up the step-wise thermal governor (Zhang Rui)

   - Introduce thermal_zone_device() for accessing the device field of
     struct thermal_zone_device and two drivers use it (Daniel Lezcano)

   - Clean up the ACPI thermal driver a bit (Daniel Lezcano)

   - Delete the thermal driver for Intel Menlow platforms that is not
     expected to have any users (Rafael Wysocki)"

* tag 'thermal-6.4-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm:
  thermal: intel: menlow: Get rid of this driver
  ACPI: thermal: Move to dedicated function sysfs extra attr creation
  ACPI: thermal: Use thermal_zone_device()
  thermal: intel: pch_thermal: Use thermal driver device to write a trace
  thermal: core: Encapsulate tz->device field
  thermal: gov_step_wise: Adjust code logic to match comment
  thermal: gov_step_wise: Delete obsolete comment
  dt-bindings: thermal: qcom-tsens: Correct unit address
  thermal/drivers/mediatek: Use of_address_to_resource()
  thermal/drivers/mediatek: Change clk_prepare_enable to devm_clk_get_enabled in mtk_thermal_probe
  thermal/drivers/mediatek: Use devm_of_iomap to avoid resource leak in mtk_thermal_probe
  thermal/drivers/mediatek: Add temperature constraints to validate read
  Revert "thermal/drivers/mediatek: Add delay after thermal banks initialization"
  thermal/drivers/cpuidle_cooling: Delete unmatched comments
  dt-bindings: thermal: Use generic ADC node name in examples
  dt-bindings: imx-thermal: Add imx6sll and imx6ul compatible

Merge branch 'thermal-core'

2023-05-03T13:44:35+00:00

Merge additional thermal core and ACPI thermal changes for 6.4-rc1:

 - Clean up the step-wise thermal governor (Zhang Rui).

 - Introduce thermal_zone_device() for accessing the device field of
   struct thermal_zone_device and two drivers use it (Daniel Lezcano).

 - Clean up the ACPI thermal driver a bit (Daniel Lezcano).

 - Delete the thermal driver for Intel Menlow platforms that is not
   expected to have any users (Rafael Wysocki).

* thermal-core:
  thermal: intel: menlow: Get rid of this driver
  ACPI: thermal: Move to dedicated function sysfs extra attr creation
  ACPI: thermal: Use thermal_zone_device()
  thermal: intel: pch_thermal: Use thermal driver device to write a trace
  thermal: core: Encapsulate tz->device field
  thermal: gov_step_wise: Adjust code logic to match comment
  thermal: gov_step_wise: Delete obsolete comment

thermal: intel: menlow: Get rid of this driver

2023-04-27T17:24:13+00:00

According to my information, there are no active users of this driver in
the field.

Moreover, it does some really questionable things and gets in the way of
thermal core improvements, so drop it.

Signed-off-by: Rafael J. Wysocki 
Acked-by: Daniel Lezcano

thermal: intel: pch_thermal: Use thermal driver device to write a trace

2023-04-27T17:20:12+00:00

The pch_critical() callback accesses the thermal zone device structure
internals, it dereferences the thermal zone struct device and the 'type'.

Use the available accessors instead of accessing the structure directly.

Signed-off-by: Daniel Lezcano 
Signed-off-by: Rafael J. Wysocki

thermal: core: Encapsulate tz->device field

2023-04-27T17:20:12+00:00

There are still some drivers needing to play with the thermal zone
device internals. That is not the best but until we can figure out if
the information is really needed, let's encapsulate the field used in
the thermal zone device structure, so we can move forward relocating
the thermal zone device structure definition in the thermal framework
private headers.

Some drivers are accessing tz->device, that implies they need to have
the knowledge of the thermal_zone_device structure but we want to
self-encapsulate this structure and reduce the scope of the structure
to the thermal core only.

By adding this wrapper, these drivers won't need the thermal zone
device structure definition and are no longer an obstacle to its
relocation to the private thermal core headers.

Signed-off-by: Daniel Lezcano 
Signed-off-by: Rafael J. Wysocki

thermal: gov_step_wise: Adjust code logic to match comment

2023-04-27T17:17:11+00:00

For the algorithm of choosing the next target state in step_wise
governor, the code does the right thing but is implemented in a
way different from what the comment describes. And this hurts the code
readability.

As the logic in the comment is simpler, adjust the code logic to align
with the comment.

No functional change.

Signed-off-by: Zhang Rui 
[ rjw: Subject edit ]
Signed-off-by: Rafael J. Wysocki