- Restore sort order in MAINTAINERS and Kconfig,
 - Remove empty trailing line from Makefile.

Fixes: 19d3a401a617c68e ("thermal/drivers/renesas/rzg3e: Add thermal driver for the Renesas RZ/G3E SoC")
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

Merge a thermal driver fix for 6.18 from Daniel Lezcano:

"- Add missing file when importing conflicting change for the Renesas
   RZ/G3E thermal driver (Daniel Lezcano)"

* tag 'thermal-v6.18-rc1-2' of ssh://gitolite.kernel.org/pub/scm/linux/kernel/git/thermal/linux:
  thermal/drivers/renesas/rzg3e: Fix add thermal driver for the Renesas RZ/G3E SoC

When applied the change commit 19d3a401a617, a conflict appeared
resulting into a manual fix. However the new file rzg3e_thermal.c was
not added but stayed locally in source tree and miss to be merged with
the entire change.

Fix this by adding the file back.

Fixes: 19d3a401a617 ("Add thermal driver for the Renesas RZ/G3E SoC")
Reported-by: kernel test robot <lkp@intel.com>
Closes: https://lore.kernel.org/oe-kbuild-all/202509272225.sARVqv2G-lkp@intel.com
Signed-off-by: John Madieu <john.madieu.xa@bp.renesas.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>

Merge updates of thermal drivers for 6.18-rc1 from Daniel Lezcano:

"- Add the QCS615 compatible DT bindings for QCom platforms (Gaurav
   Kohli)

 - Support fallback trimming values when the fuse is empty in the R-Car
   driver (Marek Vasut)

 - Remove unneeded semicolon in the Mediatek LVTS driver (Jiapeng
   Chong)

 - Fix the LMH Kconfig option by selecting QCOM_SCM and take the
   opportunity to add the COMPILE_TEST option for the QCom's LMH
   feature (Dmitry Baryshkov)

 - Fix the missing includes and incorrect error message in the Qcom's
   LMH driver (Dmitry Baryshkov)

 - Fix comment typo and add the documentation in the Kconfig for the
   R-Car Gen3 and Gen4 (Marek Vasut)

 - Add Tegra114 SOCTHERM support (Svyatoslav Ryhel)

 - Rename the functions name in the driver to be consistent and generic
   with the different R-Car platform variants (Wolfram Sang)

 - Register the TI K3 J72xx bandgap sensor as a hwmon sensor too
   (Michael Walle)

 - Add and document the thermal sensor unit reporting the junction
   temperature of the RZ/G3S SoC (Claudiu Beznea)

 - Support the GRF in the Rockchip driver (Sebastian Reichel)

 - Add a temperature IIO sensor channel in the generic thermal ADC
   driver (Svyatoslav Ryhel)

 - Document the temperature sensor on the QCOM's Glymur platform (Manaf
   Meethalavalappu)

 - Add and document the thermal sensor unit reporting the junction
   temperature of the RZ/G3E SoC (John Madieu)"

* tag 'thermal-v6.18-rc1' of ssh://gitolite.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (24 commits)
  dt-bindings: thermal: qcom-tsens: Document the Glymur temperature Sensor
  thermal/drivers/renesas/rzg3e: Add thermal driver for the Renesas RZ/G3E SoC
  dt-bindings: thermal: r9a09g047-tsu: Document the TSU unit
  thermal/drivers/thermal-generic-adc: Add temperature sensor channel
  dt-bindings: thermal: rockchip: Tighten grf requirements
  thermal/drivers/rockchip: Shut up GRF warning
  thermal/drivers/rockchip: Unify struct rockchip_tsadc_chip format
  thermal/drivers/renesas/rzg3s: Add thermal driver for the Renesas RZ/G3S SoC
  dt-bindings: thermal: r9a08g045-tsu: Document the TSU unit
  thermal/drivers/k3_j72xx_bandgap: Register sensors with hwmon
  thermal/drivers/rcar_gen3: Fix mapping SoCs to generic Gen4 entry
  thermal/drivers/tegra: Add Tegra114 specific SOCTHERM driver
  dt-bindings: thermal: add Tegra114 soctherm header
  thermal/drivers/tegra/soctherm-fuse: Prepare calibration for Tegra114 support
  dt-bindings: thermal: Document Tegra114 SOCTHERM Thermal Management System
  thermal/drivers/rcar_gen3: Document Gen4 support in Kconfig entry
  thermal/drivers/rcar_gen3: Fix comment typo
  drivers/thermal/qcom/lmh: Fix incorrect error message
  thermal/drivers/qcom/lmh: Add missing IRQ includes
  thermal/drivers/qcom: Make LMH select QCOM_SCM
  ...

Merge an adjustment of the new Power Slider interface in the int340x
thermal driver.

* thermal-intel:
  thermal: intel: int340x: Power Slider: Validate slider_balance range

The RZ/G3E SoC integrates a Temperature Sensor Unit (TSU) block designed
to monitor the chip's junction temperature. This sensor is connected to
channel 1 of the APB port clock/reset and provides temperature measurements.

It also requires calibration values stored in the system controller registers
for accurate temperature measurement. Add a driver for the Renesas RZ/G3E TSU.

[ dlezcano: Fixed conflict with "renesas: Add support for RZ/G3S" ]

Signed-off-by: John Madieu <john.madieu.xa@bp.renesas.com>
Reviewed-by: Biju Das <biju.das.jz@bp.renesas.com>
Link: https://lore.kernel.org/r/20250917170202.197929-3-john.madieu.xa@bp.renesas.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>

To avoid duplicating sensor functionality and conversion tables, this
design allows converting an ADC IIO channel's output directly into a
temperature IIO channel. This is particularly useful for devices where
hwmon isn't suitable or where temperature data must be accessible through
IIO.

One such device is, for example, the MAX17040 fuel gauge.

Signed-off-by: Svyatoslav Ryhel <clamor95@gmail.com>
Reviewed-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
Link: https://lore.kernel.org/r/20250903162749.109910-2-clamor95@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>

Most of the recent Rockchip devices do not have a GRF associated
with the tsadc IP. Let's avoid printing a warning on those devices.

Signed-off-by: Sebastian Reichel <sebastian.reichel@collabora.com>
Reviewed-by: Dragan Simic <dsimic@manjaro.org>
Tested-by: Diederik de Haas <didi.debian@cknow.org>
Reviewed-by: Heiko Stuebner <heiko@sntech.de>
Link: https://lore.kernel.org/r/20250820-thermal-rockchip-grf-warning-v2-2-c7e2d35017b8@kernel.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>

Unify all chip descriptions to the version without any empty
lines.

Suggested-by: Heiko Stuebner <heiko@sntech.de>
Signed-off-by: Sebastian Reichel <sebastian.reichel@collabora.com>
Reviewed-by: Dragan Simic <dsimic@manjaro.org>
Reviewed-by: Heiko Stuebner <heiko@sntech.de>
Link: https://lore.kernel.org/r/20250820-thermal-rockchip-grf-warning-v2-1-c7e2d35017b8@kernel.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>

The Renesas RZ/G3S SoC features a Thermal Sensor Unit (TSU) that reports
the junction temperature. The temperature is reported through a dedicated
ADC channel. Add a driver for the Renesas RZ/G3S TSU.

Signed-off-by: Claudiu Beznea <claudiu.beznea.uj@bp.renesas.com>
Tested-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Link: https://lore.kernel.org/r/20250810122125.792966-3-claudiu.beznea.uj@bp.renesas.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>