linux-stable.git/drivers/thermal, branch v3.14.41

tick/powerclamp: Remove tick_nohz_idle abuse

2015-01-27T16:18:55+00:00

commit a5fd9733a30d18d7ac23f17080e7e07bb3205b69 upstream.

commit 4dbd27711cd9 "tick: export nohz tick idle symbols for module
use" was merged via the thermal tree without an explicit ack from the
relevant maintainers.

The exports are abused by the intel powerclamp driver which implements
a fake idle state from a sched FIFO task. This causes all kinds of
wreckage in the NOHZ core code which rightfully assumes that
tick_nohz_idle_enter/exit() are only called from the idle task itself.

Recent changes in the NOHZ core lead to a failure of the powerclamp
driver and now people try to hack completely broken and backwards
workarounds into the NOHZ core code. This is completely unacceptable
and just papers over the real problem. There are way more subtle
issues lurking around the corner.

The real solution is to fix the powerclamp driver by rewriting it with
a sane concept, but that's beyond the scope of this.

So the only solution for now is to remove the calls into the core NOHZ
code from the powerclamp trainwreck along with the exports.

Fixes: d6d71ee4a14a "PM: Introduce Intel PowerClamp Driver"
Signed-off-by: Thomas Gleixner 
Cc: Preeti U Murthy 
Cc: Viresh Kumar 
Cc: Frederic Weisbecker 
Cc: Fengguang Wu 
Cc: Frederic Weisbecker 
Cc: Pan Jacob jun 
Cc: LKP 
Cc: Peter Zijlstra 
Cc: Zhang Rui 
Link: http://lkml.kernel.org/r/alpine.DEB.2.11.1412181110110.17382@nanos
Signed-off-by: Thomas Gleixner 
Signed-off-by: Greg Kroah-Hartman

thermal: Fix error path in thermal_init()

2015-01-08T18:00:49+00:00

commit 9d367e5e7b05c71a8c1ac4e9b6e00ba45a79f2fc upstream.

thermal_unregister_governors() and class_unregister() were being called in
the wrong order.

Fixes: 80a26a5c22b9 ("Thermal: build thermal governors into thermal_sys module")
Signed-off-by: Luis Henriques 
Signed-off-by: Zhang Rui 
Signed-off-by: Greg Kroah-Hartman

thermal: hwmon: Make the check for critical temp valid consistent

2014-07-17T23:21:03+00:00

commit e8db5d6736a712a3e2280c0e31f4b301d85172d8 upstream.

On 05/21/2014 04:22 PM, Aaron Lu wrote:
> On 05/21/2014 01:57 PM, Kui Zhang wrote:
>> Hello,
>>
>> I get following error when rmmod thermal.
>>
>> rmmod  thermal
>> Killed

While dealing with this problem, I found another problem that also
results in a kernel crash on thermal module removal:

From: Aaron Lu 
Date: Wed, 21 May 2014 16:05:38 +0800
Subject: thermal: hwmon: Make the check for critical temp valid consistent

We used the tz->ops->get_crit_temp && !tz->ops->get_crit_temp(tz, temp)
to decide if we need to create the temp_crit attribute file but we just
check if tz->ops->get_crit_temp exists to decide if we need to remove
that attribute file. Some ACPI thermal zone doesn't have a valid critical
trip point and that would result in removing a non-existent device file
on thermal module unload.

Signed-off-by: Aaron Lu 
Signed-off-by: Zhang Rui 
Signed-off-by: Greg Kroah-Hartman

Thermal: thermal zone governor fix

2014-03-03T15:15:57+00:00

This patch does a cleanup about the thermal zone govenor,
setting and make the following rule.
1. For thermal zone devices that are registered w/o tz->tzp,
   they can use the default thermal governor only.
2. For thermal zone devices w/ governor name specified in
   tz->tzp->governor_name, we will use the default govenor
   if the governor specified is not available at the moment,
   and update tz->governor when the matched governor is registered.

This also fixes a problem that OF registered thermal zones
are running with no governor.

Signed-off-by: Zhang Rui 
Acked-by: Javi Merino

Thermal: Allow first update of cooling device state

2014-03-03T15:15:29+00:00

In initialization, if the cooling device is initialized at
max cooling state, and the thermal zone temperature is below
the first trip point, then the cooling state can't be updated
to the right state, untill the first trip point be triggered.

To fix this issue, allow first update of cooling device state
during registration, initialized "updated" device field as
"false" (instead of "true").

Signed-off-by: Wei Ni 
Signed-off-by: Zhang Rui

thermal,rcar_thermal: Add dependency on HAS_IOMEM

2014-03-03T15:15:02+00:00

Commit beeb5a1e (thermal: rcar-thermal: Enable driver compilation with COMPILE_TEST)
broke build on archs wihout io memory.

On archs like S390 or um this driver cannot build nor work.
Make it depend on HAS_IOMEM to bypass build failures.

drivers/thermal/rcar_thermal.c:404: undefined reference to `devm_ioremap_resource'
drivers/thermal/rcar_thermal.c:426: undefined reference to `devm_ioremap_resource'

Signed-off-by: Richard Weinberger 
Acked-by: Laurent Pinchart 
Acked-by: Kuninori Morimoto 
Signed-off-by: Zhang Rui

x86_pkg_temp_thermal: Fix the thermal zone type

2014-03-03T15:13:37+00:00

The thermal zone type should not include an instance number. Otherwise
each zone is considered a different type and the thermal-to-hwmon
bridge fails to group them all in a single hwmon device.

I also changed the type to "x86_pkg_temp", because "pkg" was too
generic, and other thermal drivers use an underscore, not a dash, as
a separator. Or maybe "cpu_pkg_temp" would be better?

Signed-off-by: Jean Delvare 
Cc: Zhang Rui 
Cc: Eduardo Valentin 
Signed-off-by: Zhang Rui

x86_pkg_temp_thermal: Do not expose as a hwmon device

2014-03-03T15:13:24+00:00

The temperature value reported by x86_pkg_temp_thermal is already
reported by the coretemp driver. So, do not expose this thermal zone
as a hwmon device, because it would be redundant.

Signed-off-by: Jean Delvare 
Cc: Zhang Rui 
Cc: Eduardo Valentin 
Acked-by: Guenter Roeck 
Signed-off-by: Zhang Rui

Thermal: update INT3404 thermal driver help text

2014-03-03T15:12:49+00:00

Signed-off-by: Zhang Rui

Merge branch 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux

2014-01-25T01:13:49+00:00

Pull thermal management updates from Zhang Rui:
 "This time, the biggest change is the work of representing hardware
  thermal properties in device tree infrastructure.

  This work includes the introduction of a device tree bindings for
  describing the hardware thermal behavior and limits, and also a parser
  to read and interpret the data, and build thermal zones and thermal
  binding parameters.  It also contains three examples on how to use the
  new representation on sensor devices, using three different drivers to
  accomplish it.  One driver is in thermal subsystem, the TI SoC
  thermal, and the other two drivers are in hwmon subsystem.

  Actually, this would be the first step of the complete work because we
  still need to check other potential drivers to be converted and then
  validate the proposed API.  But the reason why I include it in this
  pull request is that, first, this change does not hurt any others
  without using this approach, second, the principle and concept of this
  change would not break after converting the remaining drivers.  BTW,
  as you can see, there are several points in this change that do not
  belong to thermal subsystem.  Because it has been suggested by Guenter
  R that in such cases, it is recommended to send the complete series
  via one single subsystem.

  Specifics:

   - representing hardware thermal properties in device tree
     infrastructure

   - fix a regression that the imx thermal driver breaks system suspend.

   - introduce ACPI INT3403 thermal driver to retrieve temperature data
     from the INT3403 ACPI device object present on some systems.

   - introduce debug statement for thermal core and step_wise governor.

   - assorted fixes and cleanups for thermal core, cpu cooling, exynos
     thrmal, intel powerclamp and imx thermal driver"

* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (34 commits)
  thermal: remove const flag from .ops of imx thermal
  Thermal: update thermal zone device after setting emul_temp
  intel_powerclamp: Fix cstate counter detection.
  thermal: imx: add necessary clk operation
  Thermal cpu cooling: return error if no valid cpu frequency entry
  thermal: fix cpu_cooling max_level behavior
  thermal: rcar-thermal: Enable driver compilation with COMPILE_TEST
  thermal: debug: add debug statement for core and step_wise
  thermal: imx_thermal: add module device table
  drivers: thermal: Mark function as static in x86_pkg_temp_thermal.c
  thermal:samsung: fix compilation warning
  thermal: imx: correct suspend/resume flow
  thermal: exynos: fix error return code
  Thermal: ACPI INT3403 thermal driver
  MAINTAINERS: add thermal bindings entry in thermal domain
  arm: dts: make OMAP4460 bandgap node to belong to OCP
  arm: dts: make OMAP443x bandgap node to belong to OCP
  arm: dts: add cooling properties on omap5 cpu node
  arm: dts: add omap5 thermal data
  arm: dts: add omap5 CORE thermal data
  ...