linux-stable.git/drivers/thermal/qcom, branch linux-6.5.y Linux kernel stable tree thermal/drivers/qcom/temp-alarm: Use dev_err_probe 2023-06-26T10:10:22+00:00 Luca Weiss luca@z3ntu.xyz 2023-06-25T11:11:33+00:00 57c9eaa4de537e6f08819d9214de502cac5a989c Use the dev_err_probe function instead of dev_err in the probe function so that the printed message includes the return value and also handles -EPROBE_DEFER nicely. Signed-off-by: Luca Weiss <luca@z3ntu.xyz> Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20230625-spmi-temp-alarm-defer-v1-1-2d57acf36855@z3ntu.xyz 
Use the dev_err_probe function instead of dev_err in the probe function
so that the printed message includes the return value and also handles
-EPROBE_DEFER nicely.

Signed-off-by: Luca Weiss <luca@z3ntu.xyz>
Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230625-spmi-temp-alarm-defer-v1-1-2d57acf36855@z3ntu.xyz
thermal/drivers/qcom: Remove redundant msg at probe time 2023-06-26T10:03:14+00:00 Yangtao Li frank.li@vivo.com 2023-06-20T09:07:30+00:00 7adbbb3b7b2a5bc413425fe001f8e237163c435f The upper-layer devm_thermal_add_hwmon_sysfs() function can directly print error information. Signed-off-by: Yangtao Li <frank.li@vivo.com> Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20230620090732.50025-9-frank.li@vivo.com 
The upper-layer devm_thermal_add_hwmon_sysfs() function can directly
print error information.

Signed-off-by: Yangtao Li <frank.li@vivo.com>
Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230620090732.50025-9-frank.li@vivo.com
thermal/drivers/qcom/tsens-v0_1: Add MSM8909 data 2023-06-26T10:03:13+00:00 Stephan Gerhold stephan.gerhold@kernkonzept.com 2023-06-07T10:47:49+00:00 4af164c1c11895adcf0181a6c627fbcacf439107 The MSM8909 SoC has 5 thermal sensors in a TSENS v0.1 block. Like MDM9607 it uses a non-standard default slope value of 3000 [1] and needs per-sensor "correction factors" to workaround issues with the factory calibration [2]. [1]: https://git.codelinaro.org/clo/la/kernel/msm-3.18/-/blob/LA.UM.7.7.c26-09100-8x09.0/arch/arm/boot/dts/qcom/msm8909.dtsi#L476 [2]: https://git.codelinaro.org/clo/la/kernel/msm-3.18/-/commit/6df022c6d0c2c1b4a5a6c2124dba4d57910c0911 Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org> Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Signed-off-by: Stephan Gerhold <stephan.gerhold@kernkonzept.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20230508-msm8909-tsens-v5-6-5eb632235ba7@kernkonzept.com 
The MSM8909 SoC has 5 thermal sensors in a TSENS v0.1 block. Like
MDM9607 it uses a non-standard default slope value of 3000 [1] and needs
per-sensor "correction factors" to workaround issues with the factory
calibration [2].

[1]: https://git.codelinaro.org/clo/la/kernel/msm-3.18/-/blob/LA.UM.7.7.c26-09100-8x09.0/arch/arm/boot/dts/qcom/msm8909.dtsi#L476
[2]: https://git.codelinaro.org/clo/la/kernel/msm-3.18/-/commit/6df022c6d0c2c1b4a5a6c2124dba4d57910c0911

Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Signed-off-by: Stephan Gerhold <stephan.gerhold@kernkonzept.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230508-msm8909-tsens-v5-6-5eb632235ba7@kernkonzept.com
thermal/drivers/qcom/tsens-v0_1: Add mdm9607 correction offsets 2023-06-26T10:03:13+00:00 Stephan Gerhold stephan.gerhold@kernkonzept.com 2023-06-07T10:47:46+00:00 b6f739da0070c36655118618a173a59fa14c7adc According to the msm-3.18 vendor kernel from Qualcomm, mdm9607 needs "correction factors" to adjust for additional offsets observed after the factory calibration values in the fuses [1, 2]. The fixed offsets should be applied unless there is a special calibration mode value that indicates that no offsets are needed [3]. Note that the new calibration mode values are called differently in this patch compared to the vendor kernel: - TSENS_TWO_POINT_CALIB_N_WA -> ONE_PT_CALIB2_NO_OFFSET - TSENS_TWO_POINT_CALIB_N_OFFSET_WA -> TWO_PT_CALIB_NO_OFFSET This is because close inspection of the calibration function [3] reveals that TSENS_TWO_POINT_CALIB_N_WA is actually a "one point" calibration because the if statements skip all "point2" related code for it. [1]: https://git.codelinaro.org/clo/la/kernel/msm-3.18/-/commit/d9d2db1b82bf3f72f5de0803d55e6849eb5b671e [2]: https://git.codelinaro.org/clo/la/kernel/msm-3.18/-/commit/d75aef53a760e8ff7bac54049d00c8b2ee1b193e [3]: https://git.codelinaro.org/clo/la/kernel/msm-3.18/-/blob/LE.UM.4.3.2.r1-04200-9x07/drivers/thermal/msm-tsens.c#L2987-3136 Fixes: a2149ab815fc ("thermal/drivers/qcom/tsens-v0_1: Add support for MDM9607") Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org> Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Signed-off-by: Stephan Gerhold <stephan.gerhold@kernkonzept.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20230508-msm8909-tsens-v5-3-5eb632235ba7@kernkonzept.com 
According to the msm-3.18 vendor kernel from Qualcomm, mdm9607 needs
"correction factors" to adjust for additional offsets observed after the
factory calibration values in the fuses [1, 2].

The fixed offsets should be applied unless there is a special
calibration mode value that indicates that no offsets are needed [3].

Note that the new calibration mode values are called differently in this
patch compared to the vendor kernel:
  - TSENS_TWO_POINT_CALIB_N_WA        -> ONE_PT_CALIB2_NO_OFFSET
  - TSENS_TWO_POINT_CALIB_N_OFFSET_WA -> TWO_PT_CALIB_NO_OFFSET
This is because close inspection of the calibration function [3] reveals
that TSENS_TWO_POINT_CALIB_N_WA is actually a "one point" calibration
because the if statements skip all "point2" related code for it.

[1]: https://git.codelinaro.org/clo/la/kernel/msm-3.18/-/commit/d9d2db1b82bf3f72f5de0803d55e6849eb5b671e
[2]: https://git.codelinaro.org/clo/la/kernel/msm-3.18/-/commit/d75aef53a760e8ff7bac54049d00c8b2ee1b193e
[3]: https://git.codelinaro.org/clo/la/kernel/msm-3.18/-/blob/LE.UM.4.3.2.r1-04200-9x07/drivers/thermal/msm-tsens.c#L2987-3136

Fixes: a2149ab815fc ("thermal/drivers/qcom/tsens-v0_1: Add support for MDM9607")
Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Signed-off-by: Stephan Gerhold <stephan.gerhold@kernkonzept.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230508-msm8909-tsens-v5-3-5eb632235ba7@kernkonzept.com
thermal/drivers/qcom/tsens-v0_1: Fix mdm9607 slope values 2023-06-26T10:03:13+00:00 Stephan Gerhold stephan.gerhold@kernkonzept.com 2023-06-07T10:47:45+00:00 6812d1dfbca99cd5032683354bf50e0002b2aa02 According to the msm-3.18 vendor kernel from Qualcomm [1], mdm9607 uses a non-standard slope value of 3000 (instead of 3200) for all sensors. Fill it properly similar to the 8939 code added recently. [1]: https://git.codelinaro.org/clo/la/kernel/msm-3.18/-/blob/LE.UM.4.3.2.r1-04200-9x07/arch/arm/boot/dts/qcom/mdm9607.dtsi#L875 Fixes: a2149ab815fc ("thermal/drivers/qcom/tsens-v0_1: Add support for MDM9607") Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org> Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Signed-off-by: Stephan Gerhold <stephan.gerhold@kernkonzept.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20230508-msm8909-tsens-v5-2-5eb632235ba7@kernkonzept.com 
According to the msm-3.18 vendor kernel from Qualcomm [1], mdm9607 uses
a non-standard slope value of 3000 (instead of 3200) for all sensors.
Fill it properly similar to the 8939 code added recently.

[1]: https://git.codelinaro.org/clo/la/kernel/msm-3.18/-/blob/LE.UM.4.3.2.r1-04200-9x07/arch/arm/boot/dts/qcom/mdm9607.dtsi#L875

Fixes: a2149ab815fc ("thermal/drivers/qcom/tsens-v0_1: Add support for MDM9607")
Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Signed-off-by: Stephan Gerhold <stephan.gerhold@kernkonzept.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230508-msm8909-tsens-v5-2-5eb632235ba7@kernkonzept.com
thermal/drivers/qcom/tsens: Drop unused legacy structs 2023-06-26T10:03:13+00:00 Stephan Gerhold stephan.gerhold@kernkonzept.com 2023-06-07T10:47:44+00:00 c631da1f19263969fcdc04a98b14401466756e8d The old single-cell parsing code was removed for MSM8939, MDM9607 and MSM8976 but for some reason the structs defining the bit positions etc were kept around (unused). Drop them now. Cc: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Fixes: 51d78b8b1beb ("thermal/drivers/tsens: Drop single-cell code for mdm9607") Fixes: dfadb4599ab0 ("thermal/drivers/tsens: Drop single-cell code for msm8939") Fixes: 3a908971f7cb ("thermal/drivers/tsens: Drop single-cell code for msm8976/msm8956") Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org> Signed-off-by: Stephan Gerhold <stephan.gerhold@kernkonzept.com> Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20230508-msm8909-tsens-v5-1-5eb632235ba7@kernkonzept.com 
The old single-cell parsing code was removed for MSM8939, MDM9607 and
MSM8976 but for some reason the structs defining the bit positions etc
were kept around (unused). Drop them now.

Cc: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Fixes: 51d78b8b1beb ("thermal/drivers/tsens: Drop single-cell code for mdm9607")
Fixes: dfadb4599ab0 ("thermal/drivers/tsens: Drop single-cell code for msm8939")
Fixes: 3a908971f7cb ("thermal/drivers/tsens: Drop single-cell code for msm8976/msm8956")
Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Signed-off-by: Stephan Gerhold <stephan.gerhold@kernkonzept.com>
Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230508-msm8909-tsens-v5-1-5eb632235ba7@kernkonzept.com
thermal/drivers/qcom/tsens-v0_1: Add support for MSM8226 2023-06-26T10:03:13+00:00 Matti Lehtimäki matti.lehtimaki@gmail.com 2023-05-07T20:12:21+00:00 598e1afca47fdbb302ce8d288b06bcc8728efc6c The MSM8226 TSENS IP has 6 thermal sensors in a TSENS v0.1 block. The thermal sensors use non-standard slope values. Signed-off-by: Matti Lehtimäki <matti.lehtimaki@gmail.com> Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Reviewed-by: Luca Weiss <luca@z3ntu.xyz> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20230507201225.89694-4-matti.lehtimaki@gmail.com 
The MSM8226 TSENS IP has 6 thermal sensors in a TSENS v0.1 block.
The thermal sensors use non-standard slope values.

Signed-off-by: Matti Lehtimäki <matti.lehtimaki@gmail.com>
Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Reviewed-by: Luca Weiss <luca@z3ntu.xyz>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230507201225.89694-4-matti.lehtimaki@gmail.com
thermal/hwmon: Use the right device for devm_thermal_add_hwmon_sysfs() 2023-03-03T19:45:02+00:00 Daniel Lezcano daniel.lezcano@linaro.org 2023-03-01T20:14:36+00:00 4a16c190f761cb3a87dcbbf355f91c71ce1f8c0b The devres variant of thermal_add_hwmon_sysfs() only takes the thermal zone structure pointer as parameter. Actually, it uses the tz->device to add it in the devres list. It is preferable to use the device registering the thermal zone instead of the thermal zone device itself. That prevents the driver accessing the thermal zone structure internals and it is from my POV more correct regarding how devm_ is used. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Acked-by: Martin Blumenstingl <martin.blumenstingl@googlemail.com> #amlogic_thermal Acked-by: Jernej Skrabec <jernej.skrabec@gmail.com> #sun8i_thermal Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> #MediaTek auxadc Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> 
The devres variant of thermal_add_hwmon_sysfs() only takes the thermal
zone structure pointer as parameter.

Actually, it uses the tz->device to add it in the devres list.

It is preferable to use the device registering the thermal zone
instead of the thermal zone device itself. That prevents the driver
accessing the thermal zone structure internals and it is from my POV
more correct regarding how devm_ is used.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Martin Blumenstingl <martin.blumenstingl@googlemail.com> #amlogic_thermal
Acked-by: Jernej Skrabec <jernej.skrabec@gmail.com> #sun8i_thermal
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> #MediaTek auxadc
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
thermal/core: Use the thermal zone 'devdata' accessor in thermal located drivers 2023-03-03T19:45:02+00:00 Daniel Lezcano daniel.lezcano@linaro.org 2023-03-01T20:14:30+00:00 5f68d0785e5258ab5e6df9e351929973a0742c1a The thermal zone device structure is exposed to the different drivers and obviously they access the internals while that should be restricted to the core thermal code. In order to self-encapsulate the thermal core code, we need to prevent the drivers accessing directly the thermal zone structure and provide accessor functions to deal with. Use the devdata accessor introduced in the previous patch. No functional changes intended. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> #R-Car Acked-by: Mark Brown <broonie@kernel.org> Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> #MediaTek auxadc and lvts Reviewed-by: Balsam CHIHI <bchihi@baylibre.com> #Mediatek lvts Reviewed-by: Adam Ward <DLG-Adam.Ward.opensource@dm.renesas.com> #da9062 Reviewed-by: Baolin Wang <baolin.wang@linux.alibaba.com> #spread Acked-by: Jernej Skrabec <jernej.skrabec@gmail.com> #sun8i_thermal Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> Acked-by: Florian Fainelli <f.fainelli@gmail.com> #Broadcom Reviewed-by: Dhruva Gole <d-gole@ti.com> # K3 bandgap Acked-by: Linus Walleij <linus.walleij@linaro.org> Acked-by: Heiko Stuebner <heiko@sntech.de> #rockchip Reviewed-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com> #uniphier Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> 
The thermal zone device structure is exposed to the different drivers
and obviously they access the internals while that should be
restricted to the core thermal code.

In order to self-encapsulate the thermal core code, we need to prevent
the drivers accessing directly the thermal zone structure and provide
accessor functions to deal with.

Use the devdata accessor introduced in the previous patch.

No functional changes intended.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> #R-Car
Acked-by: Mark Brown <broonie@kernel.org>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> #MediaTek auxadc and lvts
Reviewed-by: Balsam CHIHI <bchihi@baylibre.com> #Mediatek lvts
Reviewed-by: Adam Ward <DLG-Adam.Ward.opensource@dm.renesas.com> #da9062
Reviewed-by: Baolin Wang <baolin.wang@linux.alibaba.com>  #spread
Acked-by: Jernej Skrabec <jernej.skrabec@gmail.com> #sun8i_thermal
Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Florian Fainelli <f.fainelli@gmail.com> #Broadcom
Reviewed-by: Dhruva Gole <d-gole@ti.com> # K3 bandgap
Acked-by: Linus Walleij <linus.walleij@linaro.org>
Acked-by: Heiko Stuebner <heiko@sntech.de> #rockchip
Reviewed-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com> #uniphier
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Merge tag 'soc-drivers-6.3' of git://git.kernel.org/pub/scm/linux/kernel/git/soc/soc 2023-02-27T18:04:49+00:00 Linus Torvalds torvalds@linux-foundation.org 2023-02-27T18:04:49+00:00 11c70529983e8136ea1bd5c32e4f9cd14503c644 Pull ARM SoC driver updates from Arnd Bergmann: "As usual, there are lots of minor driver changes across SoC platforms from NXP, Amlogic, AMD Zynq, Mediatek, Qualcomm, Apple and Samsung. These usually add support for additional chip variations in existing drivers, but also add features or bugfixes. The SCMI firmware subsystem gains a unified raw userspace interface through debugfs, which can be used for validation purposes. Newly added drivers include: - New power management drivers for StarFive JH7110, Allwinner D1 and Renesas RZ/V2M - A driver for Qualcomm battery and power supply status - A SoC device driver for identifying Nuvoton WPCM450 chips - A regulator coupler driver for Mediatek MT81xxv" * tag 'soc-drivers-6.3' of git://git.kernel.org/pub/scm/linux/kernel/git/soc/soc: (165 commits) power: supply: Introduce Qualcomm PMIC GLINK power supply soc: apple: rtkit: Do not copy the reg state structure to the stack soc: sunxi: SUN20I_PPU should depend on PM memory: renesas-rpc-if: Remove redundant division of dummy soc: qcom: socinfo: Add IDs for IPQ5332 and its variant dt-bindings: arm: qcom,ids: Add IDs for IPQ5332 and its variant dt-bindings: power: qcom,rpmpd: add RPMH_REGULATOR_LEVEL_LOW_SVS_L1 firmware: qcom_scm: Move qcom_scm.h to include/linux/firmware/qcom/ MAINTAINERS: Update qcom CPR maintainer entry dt-bindings: firmware: document Qualcomm SM8550 SCM dt-bindings: firmware: qcom,scm: add qcom,scm-sa8775p compatible soc: qcom: socinfo: Add Soc IDs for IPQ8064 and variants dt-bindings: arm: qcom,ids: Add Soc IDs for IPQ8064 and variants soc: qcom: socinfo: Add support for new field in revision 17 soc: qcom: smd-rpm: Add IPQ9574 compatible soc: qcom: pmic_glink: remove redundant calculation of svid soc: qcom: stats: Populate all subsystem debugfs files dt-bindings: soc: qcom,rpmh-rsc: Update to allow for generic nodes soc: qcom: pmic_glink: add CONFIG_NET/CONFIG_OF dependencies soc: qcom: pmic_glink: Introduce altmode support ... 
Pull ARM SoC driver updates from Arnd Bergmann:
 "As usual, there are lots of minor driver changes across SoC platforms
  from NXP, Amlogic, AMD Zynq, Mediatek, Qualcomm, Apple and Samsung.
  These usually add support for additional chip variations in existing
  drivers, but also add features or bugfixes.

  The SCMI firmware subsystem gains a unified raw userspace interface
  through debugfs, which can be used for validation purposes.

  Newly added drivers include:

   - New power management drivers for StarFive JH7110, Allwinner D1 and
     Renesas RZ/V2M

   - A driver for Qualcomm battery and power supply status

   - A SoC device driver for identifying Nuvoton WPCM450 chips

   - A regulator coupler driver for Mediatek MT81xxv"

* tag 'soc-drivers-6.3' of git://git.kernel.org/pub/scm/linux/kernel/git/soc/soc: (165 commits)
  power: supply: Introduce Qualcomm PMIC GLINK power supply
  soc: apple: rtkit: Do not copy the reg state structure to the stack
  soc: sunxi: SUN20I_PPU should depend on PM
  memory: renesas-rpc-if: Remove redundant division of dummy
  soc: qcom: socinfo: Add IDs for IPQ5332 and its variant
  dt-bindings: arm: qcom,ids: Add IDs for IPQ5332 and its variant
  dt-bindings: power: qcom,rpmpd: add RPMH_REGULATOR_LEVEL_LOW_SVS_L1
  firmware: qcom_scm: Move qcom_scm.h to include/linux/firmware/qcom/
  MAINTAINERS: Update qcom CPR maintainer entry
  dt-bindings: firmware: document Qualcomm SM8550 SCM
  dt-bindings: firmware: qcom,scm: add qcom,scm-sa8775p compatible
  soc: qcom: socinfo: Add Soc IDs for IPQ8064 and variants
  dt-bindings: arm: qcom,ids: Add Soc IDs for IPQ8064 and variants
  soc: qcom: socinfo: Add support for new field in revision 17
  soc: qcom: smd-rpm: Add IPQ9574 compatible
  soc: qcom: pmic_glink: remove redundant calculation of svid
  soc: qcom: stats: Populate all subsystem debugfs files
  dt-bindings: soc: qcom,rpmh-rsc: Update to allow for generic nodes
  soc: qcom: pmic_glink: add CONFIG_NET/CONFIG_OF dependencies
  soc: qcom: pmic_glink: Introduce altmode support
  ...