linux-stable.git/drivers/thermal/qcom, branch linux-6.3.y

thermal/hwmon: Use the right device for devm_thermal_add_hwmon_sysfs()

2023-07-11T17:39:25+00:00

[ Upstream commit 4a16c190f761cb3a87dcbbf355f91c71ce1f8c0b ]

The devres variant of thermal_add_hwmon_sysfs() only takes the thermal
zone structure pointer as parameter.

Actually, it uses the tz->device to add it in the devres list.

It is preferable to use the device registering the thermal zone
instead of the thermal zone device itself. That prevents the driver
accessing the thermal zone structure internals and it is from my POV
more correct regarding how devm_ is used.

Signed-off-by: Daniel Lezcano 
Acked-by: Martin Blumenstingl  #amlogic_thermal
Acked-by: Jernej Skrabec  #sun8i_thermal
Reviewed-by: AngeloGioacchino Del Regno  #MediaTek auxadc
Signed-off-by: Rafael J. Wysocki 
Stable-dep-of: 9301575df250 ("thermal/drivers/qoriq: Only enable supported sensors")
Signed-off-by: Sasha Levin

thermal/drivers/qcom/tsens-v0_1: Add mdm9607 correction offsets

2023-07-11T17:39:24+00:00

[ Upstream commit b6f739da0070c36655118618a173a59fa14c7adc ]

According to the msm-3.18 vendor kernel from Qualcomm, mdm9607 needs
"correction factors" to adjust for additional offsets observed after the
factory calibration values in the fuses [1, 2].

The fixed offsets should be applied unless there is a special
calibration mode value that indicates that no offsets are needed [3].

Note that the new calibration mode values are called differently in this
patch compared to the vendor kernel:
  - TSENS_TWO_POINT_CALIB_N_WA        -> ONE_PT_CALIB2_NO_OFFSET
  - TSENS_TWO_POINT_CALIB_N_OFFSET_WA -> TWO_PT_CALIB_NO_OFFSET
This is because close inspection of the calibration function [3] reveals
that TSENS_TWO_POINT_CALIB_N_WA is actually a "one point" calibration
because the if statements skip all "point2" related code for it.

[1]: https://git.codelinaro.org/clo/la/kernel/msm-3.18/-/commit/d9d2db1b82bf3f72f5de0803d55e6849eb5b671e
[2]: https://git.codelinaro.org/clo/la/kernel/msm-3.18/-/commit/d75aef53a760e8ff7bac54049d00c8b2ee1b193e
[3]: https://git.codelinaro.org/clo/la/kernel/msm-3.18/-/blob/LE.UM.4.3.2.r1-04200-9x07/drivers/thermal/msm-tsens.c#L2987-3136

Fixes: a2149ab815fc ("thermal/drivers/qcom/tsens-v0_1: Add support for MDM9607")
Reviewed-by: Konrad Dybcio 
Reviewed-by: Dmitry Baryshkov 
Signed-off-by: Stephan Gerhold 
Signed-off-by: Daniel Lezcano 
Link: https://lore.kernel.org/r/20230508-msm8909-tsens-v5-3-5eb632235ba7@kernkonzept.com
Signed-off-by: Sasha Levin

thermal/drivers/qcom/tsens-v0_1: Fix mdm9607 slope values

2023-07-11T17:39:24+00:00

[ Upstream commit 6812d1dfbca99cd5032683354bf50e0002b2aa02 ]

According to the msm-3.18 vendor kernel from Qualcomm [1], mdm9607 uses
a non-standard slope value of 3000 (instead of 3200) for all sensors.
Fill it properly similar to the 8939 code added recently.

[1]: https://git.codelinaro.org/clo/la/kernel/msm-3.18/-/blob/LE.UM.4.3.2.r1-04200-9x07/arch/arm/boot/dts/qcom/mdm9607.dtsi#L875

Fixes: a2149ab815fc ("thermal/drivers/qcom/tsens-v0_1: Add support for MDM9607")
Reviewed-by: Konrad Dybcio 
Reviewed-by: Dmitry Baryshkov 
Signed-off-by: Stephan Gerhold 
Signed-off-by: Daniel Lezcano 
Link: https://lore.kernel.org/r/20230508-msm8909-tsens-v5-2-5eb632235ba7@kernkonzept.com
Signed-off-by: Sasha Levin

thermal/drivers/qcom/tsens-v0_1: Add support for MSM8226

2023-07-11T17:39:24+00:00

[ Upstream commit 598e1afca47fdbb302ce8d288b06bcc8728efc6c ]

The MSM8226 TSENS IP has 6 thermal sensors in a TSENS v0.1 block.
The thermal sensors use non-standard slope values.

Signed-off-by: Matti Lehtimäki 
Reviewed-by: Dmitry Baryshkov 
Reviewed-by: Luca Weiss 
Signed-off-by: Daniel Lezcano 
Link: https://lore.kernel.org/r/20230507201225.89694-4-matti.lehtimaki@gmail.com
Stable-dep-of: 6812d1dfbca9 ("thermal/drivers/qcom/tsens-v0_1: Fix mdm9607 slope values")
Signed-off-by: Sasha Levin

Merge tag 'soc-drivers-6.3' of git://git.kernel.org/pub/scm/linux/kernel/git/soc/soc

2023-02-27T18:04:49+00:00

Pull ARM SoC driver updates from Arnd Bergmann:
 "As usual, there are lots of minor driver changes across SoC platforms
  from NXP, Amlogic, AMD Zynq, Mediatek, Qualcomm, Apple and Samsung.
  These usually add support for additional chip variations in existing
  drivers, but also add features or bugfixes.

  The SCMI firmware subsystem gains a unified raw userspace interface
  through debugfs, which can be used for validation purposes.

  Newly added drivers include:

   - New power management drivers for StarFive JH7110, Allwinner D1 and
     Renesas RZ/V2M

   - A driver for Qualcomm battery and power supply status

   - A SoC device driver for identifying Nuvoton WPCM450 chips

   - A regulator coupler driver for Mediatek MT81xxv"

* tag 'soc-drivers-6.3' of git://git.kernel.org/pub/scm/linux/kernel/git/soc/soc: (165 commits)
  power: supply: Introduce Qualcomm PMIC GLINK power supply
  soc: apple: rtkit: Do not copy the reg state structure to the stack
  soc: sunxi: SUN20I_PPU should depend on PM
  memory: renesas-rpc-if: Remove redundant division of dummy
  soc: qcom: socinfo: Add IDs for IPQ5332 and its variant
  dt-bindings: arm: qcom,ids: Add IDs for IPQ5332 and its variant
  dt-bindings: power: qcom,rpmpd: add RPMH_REGULATOR_LEVEL_LOW_SVS_L1
  firmware: qcom_scm: Move qcom_scm.h to include/linux/firmware/qcom/
  MAINTAINERS: Update qcom CPR maintainer entry
  dt-bindings: firmware: document Qualcomm SM8550 SCM
  dt-bindings: firmware: qcom,scm: add qcom,scm-sa8775p compatible
  soc: qcom: socinfo: Add Soc IDs for IPQ8064 and variants
  dt-bindings: arm: qcom,ids: Add Soc IDs for IPQ8064 and variants
  soc: qcom: socinfo: Add support for new field in revision 17
  soc: qcom: smd-rpm: Add IPQ9574 compatible
  soc: qcom: pmic_glink: remove redundant calculation of svid
  soc: qcom: stats: Populate all subsystem debugfs files
  dt-bindings: soc: qcom,rpmh-rsc: Update to allow for generic nodes
  soc: qcom: pmic_glink: add CONFIG_NET/CONFIG_OF dependencies
  soc: qcom: pmic_glink: Introduce altmode support
  ...

thermal: Remove core header inclusion from drivers

2023-02-15T16:29:48+00:00

As the name states "thermal_core.h" is the header file for the core
components of the thermal framework.

Too many drivers are including it. Hopefully the recent cleanups
helped to self encapsulate the code a bit more and prevented the
drivers to need this header.

Remove this inclusion in every place where it is possible.

Some other drivers did a confusion with the core header and the one
exported in linux/thermal.h. They include the former instead of the
latter. The changes also fix this.

The tegra/soctherm driver still remains as it uses an internal
function which need to be replaced.

The Intel HFI driver uses the netlink internal framework core and
should be changed to prevent to deal with the internals.

No functional changes intended.

Signed-off-by: Daniel Lezcano 
Reviewed-by: Miquel Raynal  # armada_thermal.c
Reviewed-by: Kunihiko Hayashi  # uniphier_thermal.c
Reviewed-by: Niklas Söderlund  # rcar_gen3_thermal.c
Reviewed-by: Neil Armstrong  # amlogic_thermal.c
Acked-by: Florian Fainelli  # bcm2835_thermal.c
Acked-by: Thierry Reding  # tegra30-tsensor.c
Link: https://lore.kernel.org/r/20230206153432.1017282-1-daniel.lezcano@linaro.org
Signed-off-by: Rafael J. Wysocki

firmware: qcom_scm: Move qcom_scm.h to include/linux/firmware/qcom/

2023-02-09T03:15:16+00:00

Move include/linux/qcom_scm.h to include/linux/firmware/qcom/qcom_scm.h.
This removes 1 of a few remaining Qualcomm-specific headers into a more
approciate subdirectory under include/.

Suggested-by: Bjorn Andersson 
Signed-off-by: Elliot Berman 
Reviewed-by: Guru Das Srinagesh 
Acked-by: Mukesh Ojha 
Signed-off-by: Bjorn Andersson 
Link: https://lore.kernel.org/r/20230203210956.3580811-1-quic_eberman@quicinc.com

thermal/drivers/qcom-spmi-adc-tm5: Use asm intead of asm-generic

2023-01-18T08:17:28+00:00

There is no point to specify asm-generic for the unaligned.h.
Drop the 'generic' suffix.

Signed-off-by: Andy Shevchenko 
Reviewed-by: Dmitry Baryshkov 
Link: https://lore.kernel.org/r/20230103145339.40501-1-andriy.shevchenko@linux.intel.com
Signed-off-by: Daniel Lezcano

thermal/drivers/qcom: Remove duplicate set next trip point interrupt code

2023-01-16T12:05:24+00:00

The tsens driver reprogram the next trip points in the irq
handler. This function then call thermal_zone_device_update().

However, thermal_zone_device_update() calls thermal_zone_set_trips()
and from there it calls the backend 'set_trips' ops. This one in turn
reprogram the next trip points (low/high).

Consequently, the code setting the next trip points interrupt in the
interrupt handle is not needed and could be removed.

Reviewed-by: Bjorn Andersson 
Acked-by: Amit Kucheria 
Signed-off-by: Daniel Lezcano 
Link: https://lore.kernel.org/r/20230116101955.3961427-1-daniel.lezcano@linaro.org

thermal/drivers/tsens: Drop single-cell code for msm8976/msm8956

2023-01-16T10:22:30+00:00

There is no dtsi file for msm8976 in the kernel sources. Drop the
compatibility with unofficial dtsi and remove support for handling the
single-cell calibration data on msm8976.

Cc: AngeloGioacchino Del Regno 
Reviewed-by: Konrad Dybcio 
Signed-off-by: Dmitry Baryshkov 
Reviewed-by: AngeloGioacchino Del Regno 
Link: https://lore.kernel.org/r/20230101194034.831222-15-dmitry.baryshkov@linaro.org
Signed-off-by: Daniel Lezcano