commit 8e47363588377e1bdb65e2b020b409cfb44dd260 upstream.

The powerclamp cooling device cur_state shows actual idle observed by
package C-state idle counters. But the implementation is not sufficient
for multi package or multi die system. The cur_state value is incorrect.
On these systems, these counters must be read from each package/die and
somehow aggregate them. But there is no good method for aggregation.

It was not a problem when explicit CPU model addition was required to
enable intel powerclamp. In this way certain CPU models could have
been avoided. But with the removal of CPU model check with the
availability of Package C-state counters, the driver is loaded on most
of the recent systems.

For multi package/die systems, just show the actual target idle state,
the system is trying to achieve. In powerclamp this is the user set
state minus one.

Also there is no use of starting a worker thread for polling package
C-state counters and applying any compensation for multiple package
or multiple die systems.

Fixes: b721ca0d1927 ("thermal/powerclamp: remove cpu whitelist")
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Cc: 4.14+ <stable@vger.kernel.org> # 4.14+
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>

[ Upstream commit 40dc1929089fc844ea06d9f8bdb6211ed4517c2e ]

Add the PCI ID for the Wellsburg C610 series chipset PCH.

The driver can read the temperature from the Wellsburg PCH with only
the PCI ID added and no other modifications.

Signed-off-by: Tim Zimmermann <tim@linux4.de>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Signed-off-by: Sasha Levin <sashal@kernel.org>

[ Upstream commit e7fcfe67f9f410736b758969477b17ea285e8e6c ]

The return value from the call to intel_tcc_get_tjmax() is int, which can
be a negative error code. However, the return value is being assigned to
an u32 variable 'tj_max', so making 'tj_max' an int.

Eliminate the following warning:
./drivers/thermal/intel/intel_soc_dts_iosf.c:394:5-11: WARNING: Unsigned expression compared with zero: tj_max < 0

Link: https://bugzilla.openanolis.cn/show_bug.cgi?id=3637
Reported-by: Abaci Robot <abaci@linux.alibaba.com>
Signed-off-by: Yang Li <yang.lee@linux.alibaba.com>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Signed-off-by: Sasha Levin <sashal@kernel.org>

In order to prevent int340x_thermal_get_trip_type() from possibly
racing with int340x_thermal_read_trips() invoked by int3403_notify()
add locking to it in analogy with int340x_thermal_get_trip_temp().

Fixes: 6757a7abe47b ("thermal: intel: int340x: Protect trip temperature from concurrent updates")
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

Trip temperatures are read using ACPI methods and stored in the memory
during zone initializtion and when the firmware sends a notification for
change. This trip temperature is returned when the thermal core calls via
callback get_trip_temp().

But it is possible that while updating the memory copy of the trips when
the firmware sends a notification for change, thermal core is reading the
trip temperature via the callback get_trip_temp(). This may return invalid
trip temperature.

To address this add a mutex to protect the invalid temperature reads in
the callback get_trip_temp() and int340x_thermal_read_trips().

Fixes: 5fbf7f27fa3d ("Thermal/int340x: Add common thermal zone handler")
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Cc: 5.0+ <stable@vger.kernel.org> # 5.0+
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

Commit 473be51142ad ("thermal: int340x: processor_thermal: Add RFIM
driver")' added rfi_restriction_data_rate_base string, mmio details and
documentation, but missed adding attribute to sysfs.

Add missing sysfs attribute.

Fixes: 473be51142ad ("thermal: int340x: processor_thermal: Add RFIM driver")
Cc: 5.11+ <stable@vger.kernel.org> # v5.11+
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

Pull more thermal control updates from Rafael Wysocki:
 "These are updates of assorted thermal drivers, mostly for ARM
  platforms, generally isolated and fairly straightforward, and the
  recent Intel HFI driver fix for systems without HFI support.

  Specifics:

   - Avoid clearing the HFI status bit on systems without HFI support
     which triggers unchecked MSR access errors (Srinivas Pandruvada)

   - Add sm8450 and sm8550 QCom compatible string to DT bindings (Luca
     Weiss, Neil Armstrong)

   - Use devm_platform_get_and_ioremap_resource on the ST platform to
     group two calls into a single one (Minghao Chi)

   - Use GENMASK instead of bitmaps and validate the temperature after
     reading it in the imx8mm_thermal driver (Marcus Folkesson)

   - Convert generic-adc-thermal to DT schema (Rob Herring)

   - Fix debug print message with inverted logic in the k3_j72xx_bandgap
     driver (Keerthy)

   - Fix memory leak on thermal_of_zone_register() failure (Ido
     Schimmel)

   - Add support for IPQ8074 in the tsens thermal driver along with the
     DT bindings (Robert Marko)

   - Fix and rework the debugfs code in the tsens driver (Christian
     Marangi)

   - Add calibration and DT documentation for the imx8mm driver (Marek
     Vasut)

   - Add DT bindings and compatible for the Mediatek SoCs mt7981 and
     mt7983 (Daniel Golle)

   - Don't show an error message if it happens at probe time while it
     will be deferred on the QCom SPMI ADC driver (Johan Hovold)

   - Add HWMon support for the imx8mm board (Alexander Stein)

   - Remove pointless include from the power allocator governor
     (Christophe JAILLET)

   - Add interrupt DT bindings for QCom SoCs SC8280XP, SM6350 and SM8450
     (Krzysztof Kozlowski)

   - Fix inaccurate warning message for the QCom tsens gen2 (Luca Weiss)

   - Demote error log of thermal zone register to debug in the tsens
     QCom driver (Manivannan Sadhasivam)

   - Consolidate the the efuse values and the errata handling in the TI
     Bandgap driver (Bryan Brattlof)

   - Document Renesas RZ/Five as compatible with RZ/G2UL in the DT
     bindings (Lad Prabhakar)

   - Fix the irq handler return value in the LMh driver (Bjorn
     Andersson)

   - Delete empty platform remove callback from imx_sc_thermal (Uwe
     Kleine-König)"

* tag 'thermal-6.2-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm: (35 commits)
  thermal/drivers/imx_sc_thermal: Drop empty platform remove function
  thermal/drivers/qcom/lmh: Fix irq handler return value
  dt-bindings: thermal: qcom-tsens: Add compatible for sm8550
  thermal/drivers/st: Use devm_platform_get_and_ioremap_resource()
  dt-bindings: thermal: rzg2l-thermal: Document RZ/Five SoC
  dt-bindings: thermal: k3-j72xx: conditionally require efuse reg range
  dt-bindings: thermal: k3-j72xx: elaborate on binding description
  thermal/drivers/k3_j72xx_bandgap: Map fuse_base only for erratum workaround
  thermal/drivers/k3_j72xx_bandgap: Remove fuse_base from structure
  thermal/drivers/k3_j72xx_bandgap: Use bool for i2128 erratum flag
  thermal/drivers/k3_j72xx_bandgap: Simplify k3_thermal_get_temp() function
  thermal/drivers/qcom: Demote error log of thermal zone register to debug
  thermal/drivers/qcom/temp-alarm: Fix inaccurate warning for gen2
  dt-bindings: thermal: qcom-tsens: narrow interrupts for SC8280XP, SM6350 and SM8450
  thermal/core/power allocator: Remove a useless include
  thermal/drivers/imx8mm: Add hwmon support
  thermal: qcom-spmi-adc-tm5: suppress probe-deferral error message
  dt-bindings: thermal: mediatek: add compatible string for MT7986 and MT7981 SoC
  thermal: ti-soc-thermal: Drop comma after SoC match table sentinel
  thermal/drivers/imx: Add support for loading calibration data from OCOTP
  ...

When CPU doesn't support HFI (Hardware Feedback Interface), don't include
BIT 26 in the mask to prevent clearing. otherwise this results in:
    unchecked MSR access error: WRMSR to 0x1b1
      (tried to write 0x0000000004000aa8)
      at rIP: 0xffffffff8b8559fe (throttle_active_work+0xbe/0x1b0)

Fixes: 6fe1e64b6026 ("thermal: intel: Prevent accidental clearing of HFI status")
Reported-by: Linus Torvalds <torvalds@linux-foundation.org>
Tested-by: Linus Torvalds <torvalds@linux-foundation.org>
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>

Pull thermal control updates from Rafael Wysocki:
 "These include thermal core fixes to protect thermal device operations
  against thermal device removal, other thermal core fixes and updates
  of Intel thermal control drivers.

  Specifics:

   - Fix race conditions related to thermal device operations that are
     not protected against thermal device removal (Guenter Roeck)

   - Fix error code in __thermal_cooling_device_register() (Dan
     Carpenter)

   - Validate new cooling device state (coming from user space) in
     cur_state_store() and reuse the max_state value from cooling device
     structure in the sysfs interface (Viresh Kumar)

   - Fix some possible name leaks in error paths in the thermal control
     core code (Yang Yingliang)

   - Detect TCC lock bit set in the intel_tcc_cooling driver and make it
     refuse to update the TCC offset in that case (Zhang Rui)

   - Add TCC cooling support for RaptorLake-S (Zhang Rui)

   - Prevent accidental clearing of HFI status by one of the other
     drivers using the same status register (Srinivas Pandruvada)

   - Protect clearing of thermal status bits in Intel thermal control
     drivers (Srinivas Pandruvada)

   - Allow the HFI thermal control driver to ACK an HFI event for the
     previously observed timestamp (Srinivas Pandruvada)

   - Remove a pointless die_id check from the HFI thermal driver and
     adjust the definition a data structure used by it (Ricardo Neri)"

* tag 'thermal-6.2-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm:
  thermal: intel: hfi: Remove a pointless die_id check
  thermal: core: fix some possible name leaks in error paths
  thermal: intel: hfi: ACK HFI for the same timestamp
  thermal: intel: Protect clearing of thermal status bits
  thermal: intel: Prevent accidental clearing of HFI status
  thermal/core: Protect thermal device operations against thermal device removal
  thermal/core: Remove thermal_zone_set_trips()
  thermal/core: Protect sysfs accesses to thermal operations with thermal zone mutex
  thermal/core: Protect hwmon accesses to thermal operations with thermal zone mutex
  thermal/core: Introduce locked version of thermal_zone_device_update
  thermal/core: Move parameter validation from __thermal_zone_get_temp to thermal_zone_get_temp
  thermal/core: Ensure that thermal device is registered in thermal_zone_get_temp
  thermal/core: Delete device under thermal device zone lock
  thermal/core: Destroy thermal zone device mutex in release function
  thermal: intel: intel_tcc_cooling: Add TCC cooling support for RaptorLake-S
  thermal: intel: intel_tcc_cooling: Detect TCC lock bit
  thermal: intel: hfi: Improve the type of hfi_features::nr_table_pages
  thermal/core: fix error code in __thermal_cooling_device_register()
  thermal: sysfs: Reuse cdev->max_state
  thermal: Validate new state in cur_state_store()

die_id is an u16 quantity. On single-die systems the default value of
die_id is 0. No need to check for negative values.

Plus, removing this check makes Coverity happy.

Signed-off-by: Ricardo Neri <ricardo.neri-calderon@linux.intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>