linux-stable.git/drivers/thermal/Makefile, branch v6.3 Linux kernel stable tree thermal/drivers/mediatek: Relocate driver to mediatek folder 2023-02-15T16:28:25+00:00 Balsam CHIHI bchihi@baylibre.com 2023-02-09T10:56:23+00:00 fad399ebdd67f602f306b524e6f62c3570943a48 Add MediaTek proprietary folder to upstream more thermal zone and cooler drivers, relocate the original thermal controller driver to it, and rename it as "auxadc_thermal.c" to show its purpose more clearly. Signed-off-by: Balsam CHIHI <bchihi@baylibre.com> Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> Link: https://lore.kernel.org/r/20230209105628.50294-2-bchihi@baylibre.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> 
Add MediaTek proprietary folder to upstream more thermal zone and cooler
drivers, relocate the original thermal controller driver to it, and rename it
as "auxadc_thermal.c" to show its purpose more clearly.

Signed-off-by: Balsam CHIHI <bchihi@baylibre.com>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Link: https://lore.kernel.org/r/20230209105628.50294-2-bchihi@baylibre.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Merge branch 'thermal-core' 2023-02-15T16:08:30+00:00 Rafael J. Wysocki rafael.j.wysocki@intel.com 2023-02-15T16:08:30+00:00 c3bd6d539f34784b235c7070edba978f67516372 Merge thermal control core changes for 6.3-rc1: - Clean up thermal device unregistration code (Viresh Kumar). - Fix and clean up thermal control core initialization error code paths (Daniel Lezcano). - Relocate the trip points handling code into a separate file (Daniel Lezcano). - Make the thermal core fail registration of thermal zones and cooling devices if the thermal class has not been registered (Rafael Wysocki). - Make the core thermal control code use sysfs_emit_at() instead of scnprintf() where applicable (ye xingchen). * thermal-core: thermal: core: Use sysfs_emit_at() instead of scnprintf() thermal: Fail object registration if thermal class is not registered thermal/core: Move the thermal trip code to a dedicated file thermal/core: Remove unneeded ida_destroy() thermal/core: Fix unregistering netlink at thermal init time thermal: core: Use device_unregister() instead of device_del/put() thermal: core: Move cdev cleanup to thermal_release() 
Merge thermal control core changes for 6.3-rc1:

 - Clean up thermal device unregistration code (Viresh Kumar).

 - Fix and clean up thermal control core initialization error code
   paths (Daniel Lezcano).

 - Relocate the trip points handling code into a separate file (Daniel
   Lezcano).

 - Make the thermal core fail registration of thermal zones and cooling
   devices if the thermal class has not been registered (Rafael Wysocki).

 - Make the core thermal control code use sysfs_emit_at() instead of
   scnprintf() where applicable (ye xingchen).

* thermal-core:
  thermal: core: Use sysfs_emit_at() instead of scnprintf()
  thermal: Fail object registration if thermal class is not registered
  thermal/core: Move the thermal trip code to a dedicated file
  thermal/core: Remove unneeded ida_destroy()
  thermal/core: Fix unregistering netlink at thermal init time
  thermal: core: Use device_unregister() instead of device_del/put()
  thermal: core: Move cdev cleanup to thermal_release()
thermal/core: Move the thermal trip code to a dedicated file 2023-01-25T15:40:39+00:00 Daniel Lezcano daniel.lezcano@linaro.org 2023-01-23T15:27:56+00:00 5b8de18ee9027c647db4c1905f7fd0550d17d67a The thermal_core.c files contains a lot of functions handling different thermal components like the governors, the trip points, the cooling device, the OF cooling device, etc ... This organization does not help to migrate to a more sane code where there is a better self-encapsulation as all the components' internals can be directly accessed from a single file. For the sake of clarity, let's move the thermal trip points code in a dedicated thermal_trip.c file and add a function to browse all the trip points like we do with the thermal zones, the govenors and the cooling devices. The same can be done for the cooling devices and the governor code but that will come later as the current work in the thermal framework is to fix the trip point handling and use a generic trip point structure. No functional changes intended. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Reviewed-by: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> 
The thermal_core.c files contains a lot of functions handling
different thermal components like the governors, the trip points, the
cooling device, the OF cooling device, etc ...

This organization does not help to migrate to a more sane code where
there is a better self-encapsulation as all the components' internals
can be directly accessed from a single file.

For the sake of clarity, let's move the thermal trip points code in a
dedicated thermal_trip.c file and add a function to browse all the
trip points like we do with the thermal zones, the govenors and the
cooling devices.

The same can be done for the cooling devices and the governor code but
that will come later as the current work in the thermal framework is
to fix the trip point handling and use a generic trip point structure.

No functional changes intended.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
thermal: ACPI: Add ACPI trip point routines 2023-01-24T20:13:42+00:00 Rafael J. Wysocki rafael.j.wysocki@intel.com 2023-01-23T18:38:31+00:00 7a0e39748861272e6f4b088d5a7e7ffa53c4d5eb Add library routines to populate a generic thermal trip point structure with data obtained by evaluating a specific object in the ACPI Namespace. Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> Co-developed-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Tested-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com> 
Add library routines to populate a generic thermal trip point
structure with data obtained by evaluating a specific object in the
ACPI Namespace.

Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Co-developed-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
thermal/drivers/qcom: Drop false build dependency of all QCOM drivers on QCOM_TSENS 2022-10-04T09:21:11+00:00 Jonathan Cameron Jonathan.Cameron@huawei.com 2022-08-21T16:00:32+00:00 34dc523bba724f2ec1f29328dadc7f4609cae645 The SPMI QCOM drivers have no dependency in Kconfig, but the Makefile will not be included without QCOM_TSENS. This unnecessarily reduces build coverage. Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com> Cc: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Cc: Bhupesh Sharma <bhupesh.sharma@linaro.org> Acked-by: Amit Kucheria <amitk@kernel.org> Reviewed-by: Bhupesh Sharma <bhupesh.sharma@linaro.org> Link: https://lore.kernel.org/r/20220821160032.2206349-1-jic23@kernel.org Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> 
The SPMI QCOM drivers have no dependency in Kconfig, but the Makefile
will not be included without QCOM_TSENS. This unnecessarily reduces
build coverage.

Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
Cc: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Cc: Bhupesh Sharma <bhupesh.sharma@linaro.org>
Acked-by: Amit Kucheria <amitk@kernel.org>
Reviewed-by: Bhupesh Sharma <bhupesh.sharma@linaro.org>
Link: https://lore.kernel.org/r/20220821160032.2206349-1-jic23@kernel.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
thermal: k3_j72xx_bandgap: Add the bandgap driver support 2022-05-19T10:11:53+00:00 Keerthy j-keerthy@ti.com 2022-05-17T17:29:20+00:00 ffcb2fc86eb7ebc9f5524525fb57e1cccfbd1fc0 Add VTM thermal support. In the Voltage Thermal Management Module(VTM), K3 J72XX supplies a voltage reference and a temperature sensor feature that are gathered in the band gap voltage and temperature sensor (VBGAPTS) module. The band gap provides current and voltage reference for its internal circuits and other analog IP blocks. The analog-to-digital converter (ADC) produces an output value that is proportional to the silicon temperature. Currently reading temperatures only is supported. There are no active/passive cooling agent supported. J721e SoCs have errata i2128: https://www.ti.com/lit/pdf/sprz455 The VTM Temperature Monitors (TEMPSENSORs) are trimmed during production, with the resulting values stored in software-readable registers. Software should use these register values when translating the Temperature Monitor output codes to temperature values. It has an involved workaround. Software needs to read the error codes for -40C, 30C, 125C from the efuse for each device & derive a new look up table for adc to temperature conversion. Involved calculating slopes & constants using 3 different straight line equations with adc refernce codes as the y-axis & error codes in the x-axis. -40C to 30C 30C to 125C 125C to 150C With the above 2 line equations we derive the full look-up table to workaround the errata i2128 for j721e SoC. Tested temperature reading on J721e SoC & J7200 SoC. [daniel.lezcano@linaro.org: Generate look-up tables run-time] Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Keerthy <j-keerthy@ti.com> Link: https://lore.kernel.org/r/20220517172920.10857-3-j-keerthy@ti.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> 
Add VTM thermal support. In the Voltage Thermal Management
Module(VTM), K3 J72XX supplies a voltage reference and a temperature
sensor feature that are gathered in the band gap voltage and
temperature sensor (VBGAPTS) module. The band gap provides current and
voltage reference for its internal circuits and other analog IP
blocks. The analog-to-digital converter (ADC) produces an output value
that is proportional to the silicon temperature.

Currently reading temperatures only is supported.  There are no
active/passive cooling agent supported.

J721e SoCs have errata i2128: https://www.ti.com/lit/pdf/sprz455

The VTM Temperature Monitors (TEMPSENSORs) are trimmed during production,
with the resulting values stored in software-readable registers. Software
should use these  register values when translating the Temperature
Monitor output codes to temperature values.

It has an involved workaround. Software needs to read the error codes for
-40C, 30C, 125C from the efuse for each device & derive a new look up table
for adc to temperature conversion. Involved calculating slopes & constants
using 3 different straight line equations with adc refernce codes as the
y-axis & error codes in the x-axis.

-40C to 30C
30C to 125C
125C to 150C

With the above 2 line equations we derive the full look-up table to
workaround the errata i2128 for j721e SoC.

Tested temperature reading on J721e SoC & J7200 SoC.

[daniel.lezcano@linaro.org: Generate look-up tables run-time]

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Keerthy <j-keerthy@ti.com>
Link: https://lore.kernel.org/r/20220517172920.10857-3-j-keerthy@ti.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
thermal/drivers: Add TSU driver for RZ/G2L 2021-11-30T16:27:56+00:00 Biju Das biju.das.jz@bp.renesas.com 2021-11-30T15:57:57+00:00 673c68bd48390dad01f7d17670de3e33b60860ac The RZ/G2L SoC incorporates a thermal sensor unit (TSU) that measures the temperature inside the LSI. The thermal sensor in this unit measures temperatures in the range from −40 degree Celsius to 125 degree Celsius with an accuracy of ±3°C. The TSU repeats measurement at 20 microseconds intervals and automatically updates the results of measurement. The TSU has no interrupts as well as no external pins. This patch adds Thermal Sensor Unit(TSU) driver for RZ/G2L SoC. Signed-off-by: Biju Das <biju.das.jz@bp.renesas.com> Reviewed-by: Lad Prabhakar <prabhakar.mahadev-lad.rj@bp.renesas.com> Link: https://lore.kernel.org/r/20211130155757.17837-3-biju.das.jz@bp.renesas.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> 
The RZ/G2L SoC incorporates a thermal sensor unit (TSU) that measures the
temperature inside the LSI.

The thermal sensor in this unit measures temperatures in the range from
−40 degree Celsius to 125 degree Celsius with an accuracy of ±3°C. The
TSU repeats measurement at 20 microseconds intervals and automatically
updates the results of measurement.

The TSU has no interrupts as well as no external pins.

This patch adds Thermal Sensor Unit(TSU) driver for RZ/G2L SoC.

Signed-off-by: Biju Das <biju.das.jz@bp.renesas.com>
Reviewed-by: Lad Prabhakar <prabhakar.mahadev-lad.rj@bp.renesas.com>
Link: https://lore.kernel.org/r/20211130155757.17837-3-biju.das.jz@bp.renesas.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
thermal/drivers/zx: Remove zx driver 2021-02-03T08:17:47+00:00 Arnd Bergmann arnd@arndb.de 2021-01-20T16:24:00+00:00 73da3f0cca94555d08d62b60ec9b8b9582bc1313 The zte zx platform is getting removed, so this driver is no longer needed. Cc: Jun Nie <jun.nie@linaro.org> Cc: Shawn Guo <shawnguo@kernel.org> Signed-off-by: Arnd Bergmann <arnd@arndb.de> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20210120162400.4115366-3-arnd@kernel.org 
The zte zx platform is getting removed, so this driver is no
longer needed.

Cc: Jun Nie <jun.nie@linaro.org>
Cc: Shawn Guo <shawnguo@kernel.org>
Signed-off-by: Arnd Bergmann <arnd@arndb.de>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210120162400.4115366-3-arnd@kernel.org
thermal/drivers/tango: Remove tango driver 2021-02-03T08:16:54+00:00 Arnd Bergmann arnd@arndb.de 2021-01-20T16:23:59+00:00 8fefe3ce6b7d11a551d98557d5dfc5eba6477409 The tango platform is getting removed, so the driver is no longer needed. Cc: Marc Gonzalez <marc.w.gonzalez@free.fr> Cc: Mans Rullgard <mans@mansr.com> Signed-off-by: Arnd Bergmann <arnd@arndb.de> Acked-by: Mans Rullgard <mans@mansr.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20210120162400.4115366-2-arnd@kernel.org 
The tango platform is getting removed, so the driver is no
longer needed.

Cc: Marc Gonzalez <marc.w.gonzalez@free.fr>
Cc: Mans Rullgard <mans@mansr.com>
Signed-off-by: Arnd Bergmann <arnd@arndb.de>
Acked-by: Mans Rullgard <mans@mansr.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210120162400.4115366-2-arnd@kernel.org
Merge tag 'mfd-next-5.9-1' of git://git.kernel.org/pub/scm/linux/kernel/git/lee/mfd 2020-08-15T15:09:38+00:00 Linus Torvalds torvalds@linux-foundation.org 2020-08-15T15:09:38+00:00 884e0d3dd59dde1c1f0fbb5b9db2bcdc581982c7 Pull MFD updates from Lee Jones: "Core Frameworks - Make better attempt at matching device with the correct OF node - Allow batch removal of hierarchical sub-devices New Drivers - Add STM32 Clocksource driver - Add support for Khadas System Control Microcontroller Driver Removal - Remove unused driver for TI's SMSC ECE1099 New Device Support - Add support for Intel Emmitsburg PCH to Intel LPSS PCI - Add support for Intel Tiger Lake PCH-H to Intel LPSS PCI - Add support for Dialog DA revision to Dialog DA9063 New Functionality - Add support for AXP803 to be probed by I2C Fix-ups - Numerous W=1 warning fixes - Device Tree changes (stm32-lptimer, gateworks-gsc, khadas,mcu, stmfx, cros-ec, j721e-system-controller) - Enabled Regmap 'fast I/O' in stm32-lptimer - Change BUG_ON to WARN_ON in arizona-core - Remove superfluous code/initialisation (madera, max14577) - Trivial formatting/spelling issues (madera-core, madera-i2c, da9055, max77693-private) - Switch to of_platform_populate() in sprd-sc27xx-spi - Expand out set/get brightness/pwm macros in lm3533-ctrlbank - Disable IRQs on suspend in motorola-cpcap - Clean-up error handling in intel_soc_pmic_mrfld - Ensure correct removal order of sub-devices in madera - Many s/HTTP/HTTPS/ link changes - Ensure name used with Regmap is unique in syscon Bug Fixes - Properly 'put' clock on unbind and error in arizona-core - Fix revision handling in da9063 - Fix 'assignment of read-only location' error in kempld-core - Avoid using the Regmap API when atomic in rn5t618 - Redefine volatile register description in rn5t618 - Use locking to protect event handler in dln2" * tag 'mfd-next-5.9-1' of git://git.kernel.org/pub/scm/linux/kernel/git/lee/mfd: (76 commits) mfd: syscon: Use a unique name with regmap_config mfd: Replace HTTP links with HTTPS ones mfd: dln2: Run event handler loop under spinlock mfd: madera: Improve handling of regulator unbinding mfd: mfd-core: Add mechanism for removal of a subset of children mfd: intel_soc_pmic_mrfld: Simplify the return expression of intel_scu_ipc_dev_iowrite8() mfd: max14577: Remove redundant initialization of variable current_bits mfd: rn5t618: Fix caching of battery related registers mfd: max77693-private: Drop a duplicated word mfd: da9055: pdata.h: Drop a duplicated word mfd: rn5t618: Make restart handler atomic safe mfd: kempld-core: Fix 'assignment of read-only location' error mfd: axp20x: Allow the AXP803 to be probed by I2C mfd: da9063: Add support for latest DA silicon revision mfd: da9063: Fix revision handling to correctly select reg tables dt-bindings: mfd: st,stmfx: Remove I2C unit name dt-bindings: mfd: ti,j721e-system-controller.yaml: Add J721e system controller mfd: motorola-cpcap: Disable interrupt for suspend mfd: smsc-ece1099: Remove driver mfd: core: Add OF_MFD_CELL_REG() helper ... 
Pull MFD updates from Lee Jones:
 "Core Frameworks
   - Make better attempt at matching device with the correct OF node
   - Allow batch removal of hierarchical sub-devices

  New Drivers
   - Add STM32 Clocksource driver
   - Add support for Khadas System Control Microcontroller

  Driver Removal
   - Remove unused driver for TI's SMSC ECE1099

  New Device Support
   - Add support for Intel Emmitsburg PCH to Intel LPSS PCI
   - Add support for Intel Tiger Lake PCH-H to Intel LPSS PCI
   - Add support for Dialog DA revision to Dialog DA9063

  New Functionality
   - Add support for AXP803 to be probed by I2C

  Fix-ups
   - Numerous W=1 warning fixes
   - Device Tree changes (stm32-lptimer, gateworks-gsc, khadas,mcu, stmfx, cros-ec, j721e-system-controller)
   - Enabled Regmap 'fast I/O' in stm32-lptimer
   - Change BUG_ON to WARN_ON in arizona-core
   - Remove superfluous code/initialisation (madera, max14577)
   - Trivial formatting/spelling issues (madera-core, madera-i2c, da9055, max77693-private)
   - Switch to of_platform_populate() in sprd-sc27xx-spi
   - Expand out set/get brightness/pwm macros in lm3533-ctrlbank
   - Disable IRQs on suspend in motorola-cpcap
   - Clean-up error handling in intel_soc_pmic_mrfld
   - Ensure correct removal order of sub-devices in madera
   - Many s/HTTP/HTTPS/ link changes
   - Ensure name used with Regmap is unique in syscon

  Bug Fixes
   - Properly 'put' clock on unbind and error in arizona-core
   - Fix revision handling in da9063
   - Fix 'assignment of read-only location' error in kempld-core
   - Avoid using the Regmap API when atomic in rn5t618
   - Redefine volatile register description in rn5t618
   - Use locking to protect event handler in dln2"

* tag 'mfd-next-5.9-1' of git://git.kernel.org/pub/scm/linux/kernel/git/lee/mfd: (76 commits)
  mfd: syscon: Use a unique name with regmap_config
  mfd: Replace HTTP links with HTTPS ones
  mfd: dln2: Run event handler loop under spinlock
  mfd: madera: Improve handling of regulator unbinding
  mfd: mfd-core: Add mechanism for removal of a subset of children
  mfd: intel_soc_pmic_mrfld: Simplify the return expression of intel_scu_ipc_dev_iowrite8()
  mfd: max14577: Remove redundant initialization of variable current_bits
  mfd: rn5t618: Fix caching of battery related registers
  mfd: max77693-private: Drop a duplicated word
  mfd: da9055: pdata.h: Drop a duplicated word
  mfd: rn5t618: Make restart handler atomic safe
  mfd: kempld-core: Fix 'assignment of read-only location' error
  mfd: axp20x: Allow the AXP803 to be probed by I2C
  mfd: da9063: Add support for latest DA silicon revision
  mfd: da9063: Fix revision handling to correctly select reg tables
  dt-bindings: mfd: st,stmfx: Remove I2C unit name
  dt-bindings: mfd: ti,j721e-system-controller.yaml: Add J721e system controller
  mfd: motorola-cpcap: Disable interrupt for suspend
  mfd: smsc-ece1099: Remove driver
  mfd: core: Add OF_MFD_CELL_REG() helper
  ...