linux-stable.git/Documentation/thermal, branch linux-3.9.y

Merge branch 'release' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux

2013-03-01T03:48:26+00:00

Pull thermal management updates from Zhang Rui:
 "Highlights:

   - introduction of Dove thermal sensor driver.

   - introduction of Kirkwood thermal sensor driver.

   - introduction of intel_powerclamp thermal cooling device driver.

   - add interrupt and DT support for rcar thermal driver.

   - add thermal emulation support which allows platform thermal driver
     to do software/hardware emulation for thermal issues."

* 'release' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (36 commits)
  thermal: rcar: remove __devinitconst
  thermal: return an error on failure to register thermal class
  Thermal: rename thermal governor Kconfig option to avoid generic naming
  thermal: exynos: Use the new thermal trend type for quick cooling action.
  Thermal: exynos: Add support for temperature falling interrupt.
  Thermal: Dove: Add Themal sensor support for Dove.
  thermal: Add support for the thermal sensor on Kirkwood SoCs
  thermal: rcar: add Device Tree support
  thermal: rcar: remove machine_power_off() from rcar_thermal_notify()
  thermal: rcar: add interrupt support
  thermal: rcar: add read/write functions for common/priv data
  thermal: rcar: multi channel support
  thermal: rcar: use mutex lock instead of spin lock
  thermal: rcar: enable CPCTL to use hardware TSC deciding
  thermal: rcar: use parenthesis on macro
  Thermal: fix a build warning when CONFIG_THERMAL_EMULATION cleared
  Thermal: fix a wrong comment
  thermal: sysfs: Add a new sysfs node emul_temp for thermal emulation
  PM: intel_powerclamp: off by one in start_power_clamp()
  thermal: exynos: Miscellaneous fixes to support falling threshold interrupt
  ...

drm/nouveau/hwmon: s/fan0/fan1/

2013-02-20T06:00:25+00:00

Fan speed info now shown by sensors.

Signed-off-by: Ben Skeggs

drm/nouveau/doc: document the sysfs thermal management interface

2013-02-20T06:00:24+00:00

Signed-off-by: Martin Peres 
Signed-off-by: Ben Skeggs

thermal: sysfs: Add a new sysfs node emul_temp for thermal emulation

2013-02-06T05:45:42+00:00

This patch adds support to set the emulated temperature method in
thermal zone (sensor). After setting this feature thermal zone may
report this temperature and not the actual temperature. The emulation
implementation may be based on sensor capability through platform
specific handler or pure software emulation if no platform handler defined.

This is useful in debugging different temperature threshold and its
associated cooling action. Critical threshold's cannot be emulated.
Writing 0 on this node should disable emulation.

Signed-off-by: Amit Daniel Kachhap 
Acked-by: Kukjin Kim 
Signed-off-by: Zhang Rui

PM: Introduce Intel PowerClamp Driver

2013-02-06T05:45:00+00:00

Intel PowerClamp driver performs synchronized idle injection across
all online CPUs. The goal is to maintain a given package level C-state
ratio.

Compared to other throttling methods already exist in the kernel,
such as ACPI PAD (taking CPUs offline) and clock modulation, this is often
more efficient in terms of performance per watt.

Please refer to Documentation/thermal/intel_powerclamp.txt for more details.

Signed-off-by: Arjan van de Ven 
Signed-off-by: Jacob Pan 
Signed-off-by: Zhang Rui

thermal: Use thermal zone device id in netlink messages

2013-01-16T02:46:46+00:00

This patch changes the function thermal_generate_netlink_event
to receive a thermal zone device instead of a originator id.

This way, the messages will always be bound to a thermal zone.

Signed-off-by: Eduardo Valentin 
Reviewed-by: Durgadoss R 
Signed-off-by: Zhang Rui

Thermal: exynos: Add sysfs node supporting exynos's emulation mode.

2013-01-04T07:22:37+00:00

This patch supports exynos's emulation mode with newly created sysfs node.
Exynos 4x12 (4212, 4412) and 5 series provide emulation mode for thermal
management unit. Thermal emulation mode supports software debug for TMU's
operation. User can set temperature manually with software code and TMU
will read current temperature from user value not from sensor's value.
This patch includes also documentary placed under Documentation/thermal/.

Signed-off-by: Jonghwa Lee 
Signed-off-by: Zhang Rui

Thermal: Add documentation for platform layer data

2012-11-05T06:00:09+00:00

This patch adds documentation for thermal_bind_params
and thermal_zone_params structures. Also, adds details
on EXPORT_SYMBOL APIs.

Signed-off-by: Durgadoss R 
Signed-off-by: Zhang Rui

hwmon: exynos4: move thermal sensor driver to driver/thermal directory

2012-09-24T06:44:38+00:00

This movement is needed because the hwmon entries and corresponding sysfs
interface is a duplicate of utilities already provided by
driver/thermal/thermal_sys.c.  The goal is to place it in thermal folder
and add necessary functions to use the in-kernel thermal interfaces.

Signed-off-by: Amit Daniel Kachhap 
Acked-by: Guenter Roeck 
Cc: SangWook Ju 
Cc: Durgadoss 
Cc: Len Brown 
Cc: Jean Delvare 
Cc: Kyungmin Park 
Cc: Kukjin Kim 
Signed-off-by: Andrew Morton 
Signed-off-by: Amit Daniel Kachhap 
Signed-off-by: Zhang Rui

thermal: add generic cpufreq cooling implementation

2012-09-24T06:44:38+00:00

This patchset introduces a new generic cooling device based on cpufreq
that can be used on non-ACPI platforms.  As a proof of concept, we have
drivers for the following platforms using this mechanism now:

 * Samsung Exynos (Exynos4 and Exynos5) in the current patchset.
 * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal)

There is a small change in cpufreq cooling registration APIs, so a minor
change is needed for Freescale platforms.

Brief Description:

1) The generic cooling devices code is placed inside driver/thermal/*
   as placing inside acpi folder will need un-necessary enabling of acpi
   code.  This code is architecture independent.

2) This patchset adds generic cpu cooling low level implementation
   through frequency clipping.  In future, other cpu related cooling
   devices may be added here.  An ACPI version of this already exists
   (drivers/acpi/processor_thermal.c) .But this will be useful for
   platforms like ARM using the generic thermal interface along with the
   generic cpu cooling devices.  The cooling device registration API's
   return cooling device pointers which can be easily binded with the
   thermal zone trip points.  The important APIs exposed are,

   a) struct thermal_cooling_device *cpufreq_cooling_register(
        struct cpumask *clip_cpus)
   b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev)

3) Samsung exynos platform thermal implementation is done using the
   generic cpu cooling APIs and the new trip type.  The temperature sensor
   driver present in the hwmon folder(registered as hwmon driver) is moved
   to thermal folder and registered as a thermal driver.

A simple data/control flow diagrams is shown below,

Core Linux thermal <----->  Exynos thermal interface <----- Temperature Sensor
          |                             |
         \|/                            |
  Cpufreq cooling device <---------------

TODO:
*Will send the DT enablement patches later after the driver is merged.

This patch:

Add support for generic cpu thermal cooling low level implementations
using frequency scaling up/down based on the registration parameters.
Different cpu related cooling devices can be registered by the user and
the binding of these cooling devices to the corresponding trip points can
be easily done as the registration APIs return the cooling device pointer.
The user of these APIs are responsible for passing clipping frequency .
The drivers can also register to recieve notification about any cooling
action called.

[akpm@linux-foundation.org: fix comment layout]
Signed-off-by: Amit Daniel Kachhap 
Cc: Guenter Roeck 
Cc: SangWook Ju 
Cc: Durgadoss 
Cc: Len Brown 
Cc: Jean Delvare 
Cc: Kyungmin Park 
Cc: Kukjin Kim 
Signed-off-by: Andrew Morton 
Signed-off-by: Amit Daniel Kachhap 
Signed-off-by: Zhang Rui