Signed-off-by: Andreas Herrmann <herrmann.der.user@googlemail.com>
Signed-off-by: Guenter Roeck <linux@roeck-us.net>

TjMax for the CE4100 series of Atom CPUs was previously reported to be
110 degrees C.

cpuinfo logs on the web show existing CPU types CE4110, CE4150, and CE4170,
reported as "model name : Intel(R) Atom(TM) CPU CE41{1|5|7}0 @ 1.{2|6}0GHz"
with model 28 (0x1c) and stepping 10 (0x0a). Add the three known variants
to the tjmax table.

Signed-off-by: Guenter Roeck <linux@roeck-us.net>
cc: stable@vger.kernel.org
Acked-by: Jean Delvare <khali@linux-fr.org>

This config item has not carried much meaning for a while now and is
almost always enabled by default. As agreed during the Linux kernel
summit, remove it.

CC: Jean Delvare <khali@linux-fr.org>
CC: Guenter Roeck <linux@roeck-us.net>
CC: Rob Landley <rob@landley.net>
Signed-off-by: Kees Cook <keescook@chromium.org>
Signed-off-by: Guenter Roeck <linux@roeck-us.net>

Pull ACPI & Thermal updates from Len Brown:
 "The generic Linux thermal layer is gaining some new capabilities
  (generic cooling via cpufreq) and some new customers (ARM).

  Also, an ACPI EC bug fix plus a regression fix."

* 'release' of git://git.kernel.org/pub/scm/linux/kernel/git/lenb/linux: (30 commits)
  tools/power/acpi/acpidump: remove duplicated include from acpidump.c
  ACPI idle, CPU hotplug: Fix NULL pointer dereference during hotplug
  cpuidle / ACPI: fix potential NULL pointer dereference
  ACPI: EC: Add a quirk for CLEVO M720T/M730T laptop
  ACPI: EC: Make the GPE storm threshold a module parameter
  thermal: Exynos: Fix NULL pointer dereference in exynos_unregister_thermal()
  Thermal: Fix bug on cpu_cooling, cooling device's id conflict problem.
  thermal: exynos: Use devm_* functions
  ARM: exynos: add thermal sensor driver platform data support
  thermal: exynos: register the tmu sensor with the kernel thermal layer
  thermal: exynos5: add exynos5250 thermal sensor driver support
  hwmon: exynos4: move thermal sensor driver to driver/thermal directory
  thermal: add generic cpufreq cooling implementation
  Fix a build error.
  thermal: Fix potential NULL pointer accesses
  thermal: add Renesas R-Car thermal sensor support
  thermal: fix potential out-of-bounds memory access
  Thermal: Introduce locking for cdev.thermal_instances list.
  Thermal: Unify the code for both active and passive cooling
  Thermal: Introduce simple arbitrator for setting device cooling state
  ...

Signed-off-by: Peter Meerwald <pmeerw@pmeerw.net>
Signed-off-by: Jean Delvare <khali@linux-fr.org>

My name was change after migration.

Signed-off-by: Oleksij Rempel <bug-track@fisher-privat.net>
Signed-off-by: Jean Delvare <khali@linux-fr.org>

Conflicts:
	drivers/staging/omap-thermal/omap-thermal-common.
		OMAP supplied dummy TC1 and TC2,
		at the same time that the thermal tree removed them
		from thermal_zone_device_register()

	drivers/thermal/cpu_cooling.c b/drivers/thermal/cpu_cooling.c
		propogate the upstream MAX_IDR_LEVEL re-name
			to prevent a build failure

	Previously-fixed-by: Stephen Rothwell <sfr@canb.auug.org.au>

Signed-off-by: Len Brown <len.brown@intel.com>

This movement is needed because the hwmon entries and corresponding sysfs
interface is a duplicate of utilities already provided by
driver/thermal/thermal_sys.c.  The goal is to place it in thermal folder
and add necessary functions to use the in-kernel thermal interfaces.

Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Acked-by: Guenter Roeck <guenter.roeck@ericsson.com>
Cc: SangWook Ju <sw.ju@samsung.com>
Cc: Durgadoss <durgadoss.r@intel.com>
Cc: Len Brown <lenb@kernel.org>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: Kyungmin Park <kmpark@infradead.org>
Cc: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

This Patch adds support for mcp3221 chip to the
mcp3021 driver.

Signed-off-by: Sven Schuchmann <schuchmann@schleissheimer.de>
Signed-off-by: Guenter Roeck <linux@roeck-us.net>

INA220 is register compatible to INA219, and INA230 is register compatible to
INA226, so all we need to do is to add name aliases for those two chips.

Cc: Lothar Felten <l-felten@ti.com>
Signed-off-by: Guenter Roeck <linux@roeck-us.net>
Reviewed-by: Jean Delvare <khali@linux-fr.org>